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Specifications
High Quality Soldering Mobile Phone BGA Rework Station2.CCD camera and optical alignment
3.semi-automatic IR HD touch screen
High Quality Soldering Mobile Phone BGA Rework Station
Total Power |
6800W |
Top heater |
1200W |
Bottom heater |
Second heater 1200W, IR preheating 4200W |
power |
AC220V±10% 50/60Hz |
Dimensions |
L670×W750×H950 mm |
Positioning |
V-groove, PCB support can be adjusted in any direction with external universal fixture |
Temperature control |
K Sensor, Closed loop |
Temp accuracy |
±2℃ |
PCB size |
Max 430×460 mm Min 22×22 mm |
Workbench fine-tuning |
Forward/back±15mm, rigth/left±15mm |
Camera magnification |
10x-100x times |
BGA chip |
2X2-80X80mm |
Minimum chip spacing |
0.15mm |
External Temperature Sensor |
5(optional) |
Placement Accuracy |
±0.01mm |
Net weight |
91kg |
Description of High Quality Soldering Mobile Phone BGA Rework Station
1.Embedded Industrial PC, high definition touch screen interface, PLC control, and instant profile analysis function. Real-time settings and actual temperature profile display can be used to analyzed and correct parameters if necessary.
2. Three temperature areas can independently heat and are multiple controllable and adjustable to ensure best integration of different temperature areas. Heating temperature, time, angle, cooling and vacuuming can all be set on the interface.
3.It uses precise K-type close circuit control and automatic temperature adjustment system, with PLC and temperature module to enable precision temperature control of ±2 degC. External temperature sensor enables temperature monitoring and accurate analysis of real time temperature profile.
4.V-groove PCB support for rapid, convenience and accurate positioning that fits for all kinds of PCB board.
5.Flexible and convenient removable fixture on the PCB board which protectsand prevent damage to PCB. It can also adapt to rework various BGA packages.
6.Various sizes of BGA nozzles, which can be adjusted 360 degree for easy installation and replacement
7.High precision digital video registration system, rocker to make the optical lenses move in forword/back and right/left. Observe the counterpoint of four corners of BGA and central point
8.X,Y direction and R angle adopt micrometer fine-tuning. Registration accuracy can reach ±0.01MM. Equipped with high-definition liquid crystal display.
9.There are 6-8 levels of variable and constant temperature controls. Massive storage of temperature curves which are Instant accessible according to different BGA. Curve analysis, setting and adjustment are all accessible via touch screen.
10.Including Voice "early warning" function. 5-10 seconds before the completion of uninstalling or welding, voice reminder / warning to get the workers prepared. Cooling system will start after vertical wind stopped heating. When the temperature drops to room temperature, the cooling process will stop, so that the machine will not age after heated up.
11.Built-in vacuum pump
12.CE certification, with emergency switch and automatic power-off protection device when emergency happens
Structure of High Quality Soldering Mobile Phone BGA Rework Station
Function of High Quality Soldering Mobile Phone BGA Rework Station
NO |
Name |
Usage |
How to use |
1 |
Angel adjustment |
Adjust BGA angel |
Rotate button |
2 |
Top heating head |
Automatic heating equipment |
Manual or automatic through HD touch screen |
3 |
Laser positioning |
Indicate the BGA position |
Press the laser button |
4 |
Top hot air nozzle |
Control the hot air more evenly |
|
5 |
LED head light |
Lighting when working |
Press the LED button |
6 |
Bottom hot air nozzle |
Control the hot air more evenly |
|
7 |
IR plate |
Preheat the PCB board |
|
8 |
IR plate switch |
Switch of the IR plate |
Press the button |
9 |
X-axis microadjustment |
Adjust the PCB board X-axis direction |
Rotate the micrometer |
10 |
Y--axis microadjustment |
Adjust the PCB board Y-axis direction |
Rotate the micrometer |
11 |
Emergency stop |
Stop the machine immediately |
Press the button |
12 |
Laser button |
Control the laser position |
Press the button |
13 |
Start button |
Start heating |
Press the button |
14 |
LED button |
Control the LED head light |
Press the button |
15 |
LCD display |
Display the BGA picture |
Connect the power line |
16 |
Place system |
Placing the BGA chips |
Manual or automatic through HD touch screen |
17 |
PCB support |
Support the PCB boards |
|
18 |
Cross flow fan |
Cooling the PCB board after heating |
|
19 |
Lock screw |
Lock the PCB support |
Rotate the screw |
20 |
USB interface |
Transfer files |
USB connector |
21 |
Temperature sensor |
Test the outer temperature |
Connect the sensor |
22 |
Alignment brightness adjustment |
Adjust the alignment brightness |
Rotate the screw |
23 |
HD touch screen |
Operate the program |
|
More photo of High Quality Soldering Mobile Phone BGA Rework Station
Packing List
1. DH-A4 BGA rework station (touch screen) 1 set
2. Display 1 set
3. Vacuum sucker Pad 3 piece
4. Vacuum nozzle 1 set
5.DH-A4 specification(manual) 1 copy
6.Hot air nozzle 5 piece ( 31*31/38*38/41*41/34*34/55*55 )
7.Abnormity clip 6 piece
8. Blossom knob 6 piece
9. Supporting Screw 6 piece
10.External Temperature sensor 1 piec
BGA Rework Station Accessories
Packing
Company
Customer
Certification
Contact Us
Mobile:008613725586194
Office:0086 75529091833
Skype:vic8939
E-mail:sales23 @
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