CPU silica gel cooling pad 400*200*0.5/1.0/1.5/2.0/2.5mm

The HCH High thermally conductivity pad for chipset is designed with very good high thermal conductivity and coherent winding, its thermal conductivity in the thermally conductive gap filling materials is unparalleled.

Features & benefits:

1.High compressibility, soft and flexible, designed for applications in low-stress application environment

2.Nice thermal conductivity

3.Electrical insulation

4.Meet with the environmental requirements of ROHS and UL

5.Natural stickiness

Typical applications:

1.Laptop

2.Communication hardware equipment

3.High-speed hard disk drive equipment

4.Automobile engine control mould

5.Micro processor, memory chip and graphics processor

6.Mobile equipment