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Specifications
LED Sapphire UV Laser Cutting Machine For Sale1 Fully automatic operation
2 One button work
3.high reliability
LED Sapphire UV Laser Cutting Machine For Sale
Application
Mainly used in the LED sapphire substrate wafer cutting
Technology Characters:
One button operation, fully automatic operation of the dicing process;
High precision linear motion platform, the marble pedestal bearing table, the focal length automatically adjusts the body;
Automatic positioning system of the CCD image recognition can be back cut tangent;
Anti-coarsening of the visual system;
Software to automatically identify the template, angle correction, automatic contour to find the contour correction;
High reliability, low maintenance and operating costs;
The dicing process, the software automatically correct bar code reading, production data statistics and other features.
Main Technical parameters:
Processing type | |
Processing type |
UV cut |
Optical parameters | |
Laser wavelength |
355nm |
Type of laser |
Q-semiconductor solid-state lasers |
Operating parameters | |
Repeatability of the X-Y axis |
≤±0.5 um |
X-Y-axis positioning accuracy |
≤±0.1 um |
Z-axis positioning accuracy |
15 arc- sec |
The X-Y axis |
200mm |
Z-axis |
20mm |
Cutting parameters: | |
Cut to size |
2", 4" |
Cutting depth |
20~30um ±2um |
Cutting speed |
80~130mm/s |
Cutting line width |
8um |
Other parameters | |
Ambient humidity |
20~25 °C ± 2 °C |
Absolute humidity |
20%~60% ( Non-condensing) |
Compressed air |
0.5~0.8 Mpa |
Power |
220V 15A/ 50~60Hz |
Dimensions |
1200*1100*1600mm |
Machine weight |
1000kg |
Degree of automation |
Fully automatic |
Control system |
PC control |
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