LED Sapphire Laser Scribing Machine (UV Cut)
Specifications
LED Wafer High Precision UV Laser Scribing Machine1 Fully automatic operation
2 One button work
3.high reliability
LED Sapphire Laser Scribing Machine
The Main Technology Parameters
| Product Name | LED Sapphire Laser Scribing Machine | |||
| Processing type | UV cut | |||
| Laser Wavelength | 355nm | |||
| Type of Laser | semiconductor soild-state lasers | |||
| Repeatability of the X-Y-axis | ≤±0.5um | |||
| X-Y-axis positioning accuracy | ≤±0.1um | |||
| Z-axis positioning accuracy | 15arc-sec | |||
| The X-Y-axis | 200mm | |||
| Z-axis | 20mm | |||
| Cut to size | 2", 4" | |||
| Cutting depth | 20-30um±2um | |||
| Cutting Speed | 80-130mm/s | |||
| Cutting line width | 8um | |||
| Ambient Humidity | 20-25°C ±2°C | |||
| Absolute Humidity | 20%-60%(Non-condensing) | |||
| Compressed air | 0.5-0.8Mpa | |||
| Power | 220V15A/50-60Hz | |||
| Dimensions | 200* 1100* 1600mm | |||
| Machine Weight | 1000kg | |||
| Degree of automation | Fully atuomatic | |||
| Control system | PC control | |||
Applications :
Mainly used in the LED sapphire substrate wafer cutting
Technology characters :
1.One-button operaton,fully automatic operation of the dicing process;
2.High-precision linear motion platform, the marble pedestal bearing table,the focal length automatically adjusts the body; 3.Automatic positioning system of the CCD image recognition can be back cut tangent;
4.Anti-coarsening of the visual system;
5.Software to automatically identify the template,angle correction,automatic contour to find the contour correction
6.High reliability, low maintenance and operating costs;
7.The dicing process, the software automatically correct bar code reading, production statistics and other features.
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