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Lead-free & no clean Low Temperature Solder Paste
Product Description
TD Series is no clean solder paste special for SMT production process. It is made from the special solder paste and sphere tin power with little oxide content. It has the excellent performance in continuous printing. It has very little residue after reflow and very good insulation impedance.
Product Feature and Selling points
- 1. Good rollability in printing, excellent performance in printing even for 0.3mm part spacing in steel plate.
- 2. Little changes for the viscosity for continuous printing, longer life time for the stencil, and good printing performance even for continuous 8 hours printing.
- 3. No slump electron migration several hours after printing.
- 4. Excellent welding performance and proper wettability in different parts.
- 5. Adaptable to different level of welding equipments, finish welding with no nitrogenization, good performance in welding even in wide range reform temperature.
- 6. Very little residue, light in color, and good insulation impedance and no corrosion to PCB, no need clean.
- 7. Good testing performance in ICT.
- 8. Workable for paste in Hole process
Paste Alloy Composion
Alloy |
Sn48Bi58 |
Sn64Bi35Ag1 |
Sn64.7Bi35Ag0.3 |
Sn82.5Bi17Cu0.5 |
Sn42.Bi57Ag1.0 |
Solder Paste Specification
Type |
Mesh |
PSD(um) |
T2.3 |
-230/+400 |
38-63um |
T2.5 |
-230/+500 |
25-63um |
T3 |
-325/+500 |
25-45um |
T4 |
-400/+635 |
20-38um |
Scope of Application
Applicable for soldering on gold plating board, naked copper plate board, which are not high temperature resistance, such as LED photoelectricity, power supply products, distributor of television signal, connector of signal line, control board, household appliances, net working products, STB, and computer peripherals, etc. ,
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