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Help CenterLead-free Solder Paste
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Lead-free & no clean Solder Paste
Product Description
GMF is a kind of lead-free & no clean solder paste with outstanding printing performance in various-design boards, special perfect for using in the superfine spacing soldering (0.28mm). What is more, it can reduce the solder ball and solder beading.
Product Feature and Selling points
- 1. Stable in wetting and viscosity, no changes of the viscosity for storage under 35℃, and easy for transportation, storage and using.
- 2. Excellent performance in viscosity for continuous using in hot and humid environment.
- 3. Excellent printing performance in products with little space between parts
- 4. Prevent slump during preheat, solder bridging, and solder ball.
- 5. Suppress holes, reduce no melting BGA ball, well soldering on QFN.
- 6. Excellent performance and stable viscosity for continuous printing in 7 days to reduce the abandon quantity.
- 7. Suitable for high speed SMT and high speed printing
Solder Paste Alloy Composion
Alloy |
Sn96.5Ag3.0Cu0.5 |
Sn97.5Ag2.0Cu0.5 |
Sn98.5Ag1.0Cu0.5 |
Sn99Ag0.3Cu0.7 |
Sn99.3Cu0.7 |
Solder Paste Specification
Type |
Mesh |
PSD(um) |
T3 |
-325/+500 |
25-45um |
T4 |
-400/+635 |
20-38um |
Scope of Application
Applicable for soldering on gold plating board, naked copper plate board, such as main board of smartphone, tablet PC, Power supply products, control panel, household appliances, computer main board, networking products, STB, LEDTV and computer peripherals, etc.
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