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Product Specification of Lead-free Solder Wire
Product Name: Lead-free Solder Wire
No.: TF-603C
- 1. Product Features
Pure tin ingots, whose proportion of natural tin with high purity and quality has reached 99.95%, are used as raw material in the process of Tongfang TF-603C alloy Sn99.3%Cu0.7% lead-free solder wires. Silver of high purity is also one of its components. Hi-tech multi-element composite environmental flux enjoys fast wettability due to its special rosin and active ingredients. The production process has little residue, transparency and complete inertness. Lead-free solder wires are processed strictly according to EU ROHS standards. It is a kind of low-residue core solder wires and suitable for cleaning-free soldering process. The production procedures are strict from selecting high quality pure tin to inspection on finished products, which guarantees the high weldability and quality of the products.
The advantage of Tongfang lead-free solder wire:
1. Short wetting time and good weldability;
2. No rosin splashing in tin solder;
3. Balanced rosin in the wire with good continuity;
4. No bad smell, little smoke and no toxic volatile gases.
5. Neat beautiful and smooth rolls;
- 2. Product Usages
Used for high-end electronic products in precise electronic equipment, printed circuits, micro-technology, aviation industry and soldering of metal coating. Used for electronic products in home appliances, automotive electronics, industrial electronics, fuses, lighting and hardware products.
- 3. Composition of Alloy (%)
Elements |
Sn |
Pb |
Cd |
Sb |
Cu |
Bi |
Fe |
Al |
As |
Ag |
|
Content Specifications (%) |
balance |
0.05 |
0.002 |
0.05 |
0.6-0.8 |
0.05 |
0.02 |
0.005 |
0.003 |
0.003 |
Parameters of lead-free solder material
Fusion temperature(℃) |
Operating temperature(℃) |
Intensity of soldering head (δ/mpa) |
Resistivity Ρaverage/Ωm.10 |
Applicable processes |
217-227 |
350-400 |
18.8 |
0.127 |
Manual welding and tinning |
- 4. Physical Characteristics
Characteristics |
Sn99.3 Cu0.7 |
Melting point, ℃ |
217-227 |
Tensile strength, MPa |
32 |
Elongation, % |
23 |
Hardness, HV |
14.3 |
Density, g/ cm3 |
7.40 |
Heat capacity, J/kg C |
0.17 |
Thermal expansion coefficient, 10-5/°C |
1.79×10-5@30-100℃ 2.30×10-5@100-150℃ |
Time of wetting, s |
0.72 |
Wetting power, mN/mm |
0.24 |
Residual Removal
Tongfang lead-free solder residue can be left safely on the board. If necessary, the residue can be removed with Tongfang special solvent, saponification agents or semi-aqueous cleaning agents.
- 5. Product Parameters
Physical characteristics |
Typical value |
Softening point |
71℃(160°F) |
Rosin level |
Set WW according to Feb Spec .LLL-R-626 |
Specific resistance of aqueous extraction |
>1×105Ω |
Fluorine composition |
N/A |
Halogen composition |
0.05-0.15% |
Surface insulation resistance |
>1×1011Ω |
EM |
Visual and electrical inspection |
J-STD-004 classification |
ROLO J-STD-004 |
IPC-TM-650 |
2.6.3.3 |
Drying test |
Qualified |
Corrosivity |
It passes copper mirror tests and copper plate tests. It is defined as type L in IPC-TM-650 copper mirror corrosion test. |
Expansion rate |
>80% |
Rosin composition |
1.2-3.5%. It is determined on customer’s requirements (The higher the rosin composition is, the better is the wetting and the faster the welding is. However, there would be more residue and smoke. The lower the rosin composition is, the slower is the wetting and welding is. Luckily, there would be less residue and smoke.) |
Storage life/storage temperature |
18 months/0℃-40℃ |
- 6. Others
Wire diameter: 0.3-4.0mm
Package: 10 rolls per box
Packaging signs: alloy name, flux content, wire diameter, model, net weight of each box and production date.
Health and safety: Tongfang lead-free and cleaning-free solder wires are classified as non-toxic products. However, it will produce some decomposers and reactant gases in welding. Those gases should be exhausted completely to ensure the safety and comfort of operators. For detailed health and safety information, please see the Material Safe Data Sheet.
Notes: store in dry, ventilated and damp-proof environment.
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