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Product Specifications of Lead-free Solder Bar
I. Product Description
Tongfang TF-603C alloy Sn99.3%/Cu0.7% lead-free solder bar employs high-quality, ecological and high-purity tin material, and the most advanced electron welding materials from Japan and America to develop production technology. In material selection process, RoHS instruction and SS-00259 standard are strictly observed, and high-standard processes are employed in production in raw materials melting, mixing, testing and priming. Ecological tin ingots are used to produce lead-free solder bar according to the requirements of green and environment-friendly development direction and product reliability of modern electronic industry. Under the strict quality control, degree of oxidation and impurity content of metal and nonmetal are effectively controlled. The surface of solder bar is even and smooth, with high purity and high liquidity after melting, good wettability, bright solder joint and little oxidation slag and residue. The solder bar is suitable for all kinds high-quality wave soldering and manual welding.
II. Product Features
Tongfang TF-603C alloy Sn99.3%/Cu0.7% solder bars are excellent in mechanical and electrical conductivity. It is a kind of excellent heat-resistance solder, especially its inherent and fine structures, excellent mechanical properties, good wettability and reliability, which make it accepted by the electronic industry as substitute for eutectic solder.
The characteristics of TF-603C alloy Sn99.3%/Cu0.7% lead-free solder bar:
1. Ecological and high-purity solder is employed, with little solder dross and decrease of unnecessary waste.
2. Research and production technology are imported from the USA.
3. High-purity electrolytic process is employed, in which appropriate amount of antioxidants are added so that it has good antioxidant capacity and little residue.
4. Good wettability, strong mechanical strength, good liquidity, and bright welding spot.
5. It is suitable for the use of high-tech wave-soldering machine and small-sized tin stove.
The advantage of TF-603C alloy Sn99.3%/Cu0.7% lead-free solder bar:
1. There is small amount of slag after melt compared with the usual soldering, and it has excellent antioxidant properties.
2. It has low viscosity after melt, high liquidity and high degree of welding. It is most applicable to wave soldering process. Because of its little amount of oxide inclusion, icicles can be reduced as much as possible. The quality of ridging phenomenon welding is guaranteed, with bright and full solder joint.
3. III. Composition of Alloy
Element |
Sn |
Pb |
Cd |
Sb |
Cu |
Bi |
Fe |
Al |
As |
Ag |
|
Composition specification (%) |
balance |
0.05 |
0.002 |
0.05 |
0.65-0.75 |
0.03 |
0.02 |
0.002 |
0.02 |
0.03 |
IV. Physical Property
Properties |
Sn99.3 Cu 0.7 |
Melting point, ℃ |
217-221 |
Tensile strength, MPa |
32 |
Elongation, % |
23 |
Hardness, HV |
14.3 |
Density, g/cm3 |
7.40 |
Heat capacity, J/kg C |
0.17 |
CTE, 10-5/°C |
1.79×10-5@30-100℃ 2.30×10-5@100-150℃ |
Wetting time, sec |
0.72 |
Wetting force, mN/mm |
0.17 |
V. Product Parameters
Proposed parameter for wave solder when Sn99 .3Cu0.7 welding rod is used.
Parameter |
Single wave |
Double waves |
Temperature of welding tank |
255-265°C |
255-265°C |
Conveyor belt speed |
1.0-1.5m/min |
1.0-1.6m/min |
Wave contact time |
2.3-2.8s |
3.0-3.5s |
Wave height |
PCB height 1/2-2/3 |
PCB height 1/2-2/3 |
Copper content detection |
Each 12000 plate |
Each 12000 plate |
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