Lead-free Flux

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Lead-free Flux photo-5
Lead-free Flux photo-6
US$ 6.00 - 6.00 MOQ: 500 Liters
Key Specifications
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Place of Origin:
Guangdong, China
Brand Name:
Tongfang
Model Number:
TF-9000-5
Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
Delivery time depends on order quantity.
Place of Origin Guangdong, China
Brand Name Tongfang
Model Number TF-9000-5

Technical Data Sheet

 

 

I. DESCRIPTION

 

  1. 1.         TF-9000-5 is clean-free flux. It is applied in a wide range. In spraying or foaming wave-soldering, its performance is superb. The activity of the flux is specially designed, especially fit for leadless welding. Even for PCB with common weldability, its performance for welding is still good. The moderate solid content in the flux and the internal activity ensures the least residues after the welding of PCB. In addition, the surface of PCB is dry and clean. If there are no special requirements, the cleaning procedure can be saved to reduce the production cost of manufacturers.
  2. 2.         Another feature of TF-9000-5is that it has a high insulation resistance after being welded. This can ensure the reliable performance of PCB.
  3. 3.         As to TF-9000-5, it has a wide range of technical data. Thus it can be applied in different environment, equipment and practical techniques.

 

II. FEATURES

 

  1. 1.         Smooth and polished surface of weld spot
  2. 2.         High wettability
  3. 3.         Non-corrosiveness
  4. 4.         Less residues and clean-free after being welded
  5. 5.         Comply with IPC J-STD-004
  6. 6.         High insulation resistance of surface

 

III. HANDLING

 

  1. 1.         Expiration date for TF-9000-5in air-tight condition is 1 year. Do not refrigerate it.
  2. 2.         Keep away from fire. Avoid direct sunlight or high heat.
  3. 3.         Do not pack used flux and new flux together. Keep container air-tight.
  4. 4.         If flux is reserved for a long time, the user should calculate its proportion before using it, and adjust the proportion to normal by adding diluent to it.

 

 

IV. FLUX APPLICATION

 

 

Project

Suggested Technical Data

 

Coverage of Flux

Foaming: 25-55 mg/in2  calculated by solid content

 

If foaming technique is employed:

Aperture of silica foam silica foam

Top immerge depth expending foam

Hatch of top enclosure

Air pressure

 

If airbellsdoctor technique is employed:

Aperture of airbellsdoctor

Hole pitch

Airbellsdoctor pressure

Distance between airbellsdoctor and foam generator

Angle of airbellsdoctor

 

20-50um

25-40mm

10-13mm

1-2 psi

 

 

1-1.5mm

4-5mm

2psi

10-15cm

3-5°

Arm-up temperature of top side

80-110

Warm-up temperature of under side

100-130

Heating rate of top side

2-5/s

Gradient of belt conveyor

4.5-7°, usually 5-6°

Speed of belt conveyor

0.8-1.8 m/min

Time of pass wave crest

1.5-5 second

Temperature of solder machine

250-270

Note: Hereinbefore parameter is for reference only, no guarantee for the best welding effect.

For the equipment, components, PCB adopted by users are different, it is suggested that experimental design should be applied to acquire optimized parameter.

 

 

V. PROCESS CONTROL

 

The use of flux is very important during the operation, which can keep the stability of the compositions of the flux. The accurate control of wave-soldering not only guarantees constant soldering effect, but also reduces the residue after soldering to minimum, thus eradicating the disturbance to soldering probe.

 

 

 

VI. PHYSICAL PROPERTIES

 

 

Basic Physical Properties

Project

Test Results

Appearance

Yellow liquid

Smell

Of Alcohol

Physical Properties

Passed: 5±2ºC No delamination or separation by crystallization; no delaminattion below 45±2 ºC

Solid Content

5.8±0.5%

Proportion

0.814±0.01

 

 

 

 

 

Reliability

Project

Technical Requirements

Test Results

 

Resistivity of Extracted Liquid

JIS  Z3197-99

JIS  Z3283-2001

 

Pass: 5.0×104 ohm · cm

Bronze Mirror

IPC-TM-650 2.3.32

pass

AgCrO4

IPC-TM-650 2.3.33

pass

Halogen Content

JIS  Z3197-99

JIS  Z3283-2001

pass

 

 

Surface Insulation Resistance

Test Standards

Requirements

Standard

Test Results

J-STD-004

85ºC, 85% RH, 168hrs

> 1.0×108 Ohms

4.7×108Ohms

 

 

VII. RESIDUE PROPERTIES AND REMOVE

 

  1. 1.         TF-9000-5 is cleanse-free flux. There is no need to remove residue after soldering in common applications.
  2. 2.         If cleanse is necessary, the residue of TF-9000-5after soldering can be removed with relevant cleaning agents provided by Tongfang Electronic New Materials Co. Ltd..

 

 

VIII. STORAGE

 

l  TF-9000-5 is flammable. Keep away from fire or high heat. Avoid direct sunlight.

 

 

IX. HEALTH AND SAFTY

 

  1. 1.         Ensure good ventilation during operation and pay attention to personal protection.
  2. 2.         Read Material Safety Data Sheet (MSDS)carefully before using this product.
  3. 3.         Do not waste or dispose the product at random.

 

 

 

Note:

  1. 1.         This document is only used for reference and should not be used as basis of legal responsibilities.
  2. 2.         While using the item, please customize the most suitable procedure or control methods according to different techniques to guarantee the stability of quality. 

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Business Type
Manufacturer
Year Established
1997
Factory Size
Above 100,000 square meters
Total Employees
11 - 50 People

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