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Home > Industrial Equipment & Components > Welding & Soldering Supplies > Welding Flux > Clean-free Flux

Clean-free Flux

Name: Clean-free Flux
Brand: Tongfang
SKU: 115160319
Availability: InStock

US$ 6.00 - 6.00 MOQ: 100 Liters

Key Specifications

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Place of Origin:

Guangdong, China

Brand Name:

Tongfang

Model Number:

TF-328

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Shenzhen Tongfang Electronic New-Material Co., Ltd.

Payment & Shipping

Payment Methods:

Port of Shipment:

China

Delivery Detail:

Delivery time depends on order quantity.

Product Details
Company Profile
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Place of Origin Guangdong, China

Brand Name Tongfang

Model Number TF-328

Technical Data Sheet

DESCRIPTION

TF328 is clean-free flux. It is applied in a wide range. In spraying or foaming wave-soldering, its performance is superb. The activity of the flux is specially designed, especially fit for leadless welding. Even for PCB with common weldability, its performance for welding is still good. The moderate solid content in the flux and the internal activity ensures the least residues after the welding of PCB. In addition, the surface of PCB is dry and clean. If there are no special requirements, the cleaning procedure can be saved to reduce the production cost of manufacturers.
Another feature of TF 328 is that it has a high insulation resistance after being welded. This can ensure the reliable performance of PCB.
As to TF328, it has a wide range of technical data. Thus it can be applied in different environment, equipment and practical techniques.

FEATURES

Smooth and polished surface of weld spot
High wettability
Non-corrosiveness
Less residues and clean-free after being welded
Comply with IPC J-STD-004
High insulation resistance of surface

HANDLING

Expiration date for TF-88-7 in air-tight condition is 1 year. Do not refrigerate it.
Keep away from fire. Avoid direct sunlight or high heat.
Do not pack used flux and new flux together. Keep container air-tight.
If flux is reserved for a long time, the user should calculate its proportion before using it, and adjust the proportion to normal by adding diluent to it.

FLUX APPLICATION

Project	Suggested Technical Data
Coverage of Flux	calculated by flow30-50 ml/min
If foaming technique is employed: Aperture of silica foam silica foam Top immerge depth expending foam Hatch of top enclosure Air pressure If airbellsdoctor technique is employed: Aperture of airbellsdoctor Hole pitch Airbellsdoctor pressure Distance between airbellsdoctor and foam generator Angle of airbellsdoctor	20-50um 25-40mm 10-13mm 1-2psi 1-1.5mm 4-5mm 2psi 10-15cm 3-5^o
Arm-up temperature of top side	80-110°C
Warm-up temperature of under side	100-130°C
Heating rate of top side	2-5°C/s
Gradient of belt conveyor	4.5-7°, usually 5-6°
Speed of belt conveyor	0.8-1.8 m/min
Time of pass wave crest	1.5-5 second
Temperature of solder machine	250-270°C
Note: Hereinbefore parameter is for reference only, no guarantee for the best welding effect. For the equipment, components, PCB adopted by users are different, it is suggested that experimental design should be applied to acquire optimized parameter.

PROCESS CONTROL

The use of flux is very important during the operation, which can keep the stability of the compositions of the flux. The accurate control of wave-soldering not only guarantees constant soldering effect, but also reduces the residue after soldering to minimum, thus eradicating the disturbance to soldering probe.

Temperature curve

PHYSICAL PROPERTIES

Basic Physical Properties

Project	Test results
Appearance	Yellow liquid
Smell	Alcohol
Physical Properties	Pass: 5±2ºC No delamination or separation by crystallization, no delaminattion below 45±2 ºC
Solid Content	5.8 0.5%
Proportion	0.809± 0.01

Reliability

Project	Technical Requirements	Test Results
Resistivity of Extracted Liquid	JIS Z3197-99 JIS Z3283-2001	Pass: 5.0×10⁴ ohm · cm
Bronze Mirror	IPC-TM-650 2.3.32	NA
Halogen Content	JIS Z3197-99 JIS Z3283-2001	< 0.1%

Surface Insulation Resistance

Test Standard	Requirement	Standard	Test Result
J-STD-004	85ºC, 85% RH, 168hrs	> 1.0×10⁸ Ohms	4.7×10⁸Ohms

ESIDUE PROPERTIES AND REMOVE

TF-328 is cleanse-free flux. There is no need to remove residue after soldering in common applications.

If cleanse is necessary, the residue of TF-328 after soldering can be removed with relevant cleaning agents provided by Tongfang Electronic New Materials Co. Ltd..

STORAGE

TF-328is flammable. Keep away from fire or high heat. Avoid direct sunlight.

HEALTH & SAFETY

Ensure good ventilation during operation and pay attention to personal protection.
Read Material Safety Data Sheet (MSDS) carefully before using this product.
Do not waste or dispose the product at random.

Note:

This document is only used for reference and should not be used as basis of legal responsibilities.
While using the item, please customize the most suitable procedure or control methods according to different techniques to guarantee the stability of quality.