1660 Tie-point Solderless Breadboard test prototype board TCB-204

1660 Tie-point Solderless Breadboard

SPECIFICATIONS

Contact Resistance: 100mΩmax

Insulator Resistance: 1000Mωmin.@DC 500V

Dielectric withstanding Voltage:AC 500V For 1 minute

Operating Temperature: -20°C–+80°C

Housing Material: ABS

Contact Material: Copper alloy nickel plated

Contact way: Spring clip

Connector Type: Socket

Recycle use

aluminium base board

Socket metal:phosphor bronze/beryllium copper for choice

Terminal Strip:2×630

Distribution Strip:4×100

Binding Post:3

Plug times: ≥10000 times

Housing size( L*W*H)

 23cm*13cm*0.835cm

pitch=2.54mm  /  0.1''

all material Rohs compliance