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Industrial new products integrated circuit electronic system on module
Core Module is designed by 8-floor PCB; On-board CPU, SDRAM, NandFlash, DataFLash, with commonly used interfaces, such as TFT-LCD, touch screen, network, SPI, PWM, CAN, timer, matrix keypad, IDE, high-speed USB HostDevice, SD card, RS232485 serial port, audio, etc
Industrial new products integrated circuit electronic system on module Specifications
CPU Processor
• ATMEL AT91SAM9263, ARM926EJ-S core
• DSP expand instructions, JAVA hardware acceleration
• 200MHz
SDRAM Memory
• 64MB SDRAM, 2-piece 4Banks x 4Mbitsx16bits SDRAM
FLASH Storage
• On-board 512K DataFlash (DB45041D)
• On-board 128M*8bits NandFlash (K9F1G08U0B)
• Could change a large capacity or industrial chip according to customer's requirement
PCB Specification & Size
• Using eight floors of PCB high precision process, and has the best electrical properties and anti-jamming performance
• 96 x 90 x 1.5mm
Working Parameters
• Working temperature: -20°C~ 70°C (batch user could customize -40°C~ 85°C)
• Humidity Range: 5%~ 95%, Non-Condensing
Low Power Consumption
• 5V Dc power supply, low power consumption, <1W
Support OS
• Linux2.6.30 + QT2.3
• Windows 5.0, WindowsCE 6.0
System on module For Smart Home technical Support:
• The problems that customer encounter in the process of development on the products• System cut, according to customer's requirements
• Develop related drivers, according to the demand of customer(another pay)
• Customized development of back plane, according to customer's requirements(another pay)
System on Module For Smart Home Order Infomation
| Item | QY-9263P | ||
|---|---|---|---|
| DVD resources | Linux | Compilers | Cross-compiler arm-linux-gcc |
Tool software | Supporting terminal, writing, download tools | ||
Device manual | Main components'datasheet of back plane | ||
User manual | About all development and use | ||
Image file | Bootstarp, u-boot, kernal, image file of file system | ||
Test source code | Test routines and source codes of all interfaces | ||
System source code | Include bootstrap, u-boot, kernel, file system and QT source code | ||
Schematic | Back plane's schematic in PDF format | ||
Packaging library | Component packaging library of evaluation board | ||
Windows CE | Tool software | Supporting terminal, writing, download tools, sync software | |
Device manual | Main components' datasheet of back plane | ||
User manual | About all development and use | ||
Image file | Firstboot, Eboot, NK image file | ||
Test source code | Test routines and source codes of all interfaces | ||
BSP package | Related BSP board-level supporting package | ||
SDK | Related SDK | ||
Schematic | Back plane's schematic in PDF format | ||
Packaging library | Back plane's schematic in PDF format | ||
| LCD options
| 4.3' LCD module + 4-wire resistive touch screen +USB cable | ||
5.6' LCD module + 4-wire resistive touch screen +USB cable | |||
6.4' LCD + 4-wire resistive touch screen + USB cable + inverter | |||
7' LCD module + 4-wire resistive touch screen +USB cable | |||
8' LCD module + 4-wire resistive touch screen +USB cable | |||
10.4' LCD + 4-wire resistive touch screen + USB cable + inverter | |||
Module options | TTL to LVDS module | ||
TTL to VGA module | |||
Sales hotline | +86-571- 89935913 | ||
Industrial new products integrated circuit electronic system of module Application:
Send Inquiry to This Supplier
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