CPU Silicone heat transfer compound

Specifications

Silicone heat transfer compound
Low thermal resistance
Factory price
Good after-sale service
Replace of ShinEtsu

Product name:  Silicone heat transfer compound   

 

Features                                                                             Applications                             

.Thermal conductivity: 2.0/3.0/5.0 W/M-K                    . CPU and Chipset cooler                    

. Low thermal resistance                                              . Switching mode power

. RoHS & UL compliance                                              . Electronic Home compliance

                                                                                           . LED industry

                                                                                           . Others

 

Store Method:

 . This item can be saved for 18 months when it is sealed under room temperature 25°C.

 

Physical Properties of  Silicone heat transfer compound  :

PROPERTY	G100	G-200	G-300	G-500	TEST METHOD	UNIT
Density	1.8	2.3	2.7	3.2	ASTM D792	---
Color	White	Gray	Gray	Gray	---	Visual
Volatile Content	0.6	0.5	0.3	0.2	ASTM E595	%/Wt
Thermal Conductivity	1.0	2.0	3.0	5.0	ASTM D5470	W/mK
Thermal Resistance	0.056	0.041	0.025	0.009	ASTM D5470	C-In2/W
Breakdown Voltage	1300	1100	1000	600	ASTM D149	VAC/mil
Dielectric Constant	4.4	4.5	4.7	4.8	ASTM D150	---
Volume Voltage	>1013	>1013	>1013	>1012	ASTM D257	---
Work Temp	-50℃  to  200℃

 

  

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Picture of    Silicone heat transfer compound :