Android mobile phone motherboard pcb soft and rigid combination board Split flexible PCBs Hard and soft binding plate

     Specifications

                                                                                    Details

Material Type

FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont

Material Thickness ( in inches)

0.062”, 0.080”, 0.093”, 0.125”, 0.200”, 0.047”, 0.031”, 0.030”, 0.005"

Layer count

1 to 8 Layers

Max. Board Size

6000mm*1000mm

IPC Class

Class II, Class III ,  Class 1

Annular Ring

5 mil/side or Greater (Min. Design)

Finish Plating

Solder(HASL), Lead Free Solder(HASL), ENIG (ELectroless Nickel Immersion Gold), OSP, Immersion Silver,Immersion Tin, Immersion Nickel, Hard Gold,  Other

Copper Weight

0.5OZ-7OZ

Trace/Space Width

 3 Mils or Greater

Drill Clearance

0.1mm(laser drilling)

Plated Slots

0.036 or Greater

Smallest Hole (Finished)

0.1mm or Greater

Gold Fingers

1 to 4 Edge (30 to 50 Micron Gold)

SMD Pitch

0.080” -  0.020” -  0.010”

Soldermask Type

LPI Glossy, LPI-Matte, SR1000

Soldermask Color

Green, Red, Blue, Black, White, Yellow,

Legend Color

White, Yellow, Black, Red, Blue,green,Matte green,matte green

CNC Route Point

Any

Minimum Route Width

0.031”

Scoring

Straight Lines, Jump Scoring, Panel Edge to Edge, CNC*

Body Gold

HARD*, IMMERSION* (up to 50 MICRON GOLD)

Data File Format

Gerber 274x with embedder aperture

 Fab. Drawing Format

DXF, HPGL, DWG, PDF, Gerber

E.T Testing

Flying Probe, Single Sided, 1up Plate, Clampshell, Net List

Counter Sink / Counter Bore

Availiable up to 0.250 Diameter

Control Impedence

Yes

Blind Vias / Buried Vias

Yes

Peelable Mask

Yes

Carbon

Yes

Packaging Detail:

Anti-static bag, bubble pack, carton box,Vacuum...

Delivery Detail:

10-15Days, delivery just-in-time