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Item

Manufacture Capability

Material

FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based

Layer No.

1-16

Finished Board thickness

0.2 mm-3.8mm  (8 mil-150 mil)

Board Thickness Tolerance

±10%

Cooper thickness

0.5 OZ-6OZ (18 um-210 um)

Copper Plating Hole

18-40 um

Impedance Control

±10%

Warp&Twist

0.70%

Peelable

0.012"(0.3mm)-0.02  (0.5mm)

Images

Min Trace Width (a)

0.075mm (3mil)

Min Space Width (b)

0.1mm (4 mil)

Min Annular Ring

0.1mm (4 mil)

SMD Pitch (a)

0.2 mm(8 mil)

BGA Pitch (b)

0.2 mm (8 mil)

0.05mm

Solder Mask

Min Solder Mask Dam (a)

0.0635 mm (2.5mil)

Soldermask Clearance (b)

0.1mm (4 mil)

Min SMT Pad spacing (c)

0.1mm (4 mil)

Solder Mask Thickness

0.0007"(0.018mm)

Holes

Min Hole size (CNC)

0.2 mm (8 mil)

Min Punch Hole Size

0.9 mm (35 mil)

Hole Size Tol (+/-)

PTH:±0.075mm;NPTH: ±0.05mm

Hole Position Tol

±0.075mm

Plating

HASL

2.5um

Lead free HASL

2.5um

Immersion Gold

Nickel  3-7um  Au:1-5u''

OSP

0.2-0.5um

Outline

Panel Outline Tol (+/-)

CNC: ±0.125mm, Punching: ±0.15mm

Beveling

30°45°

Gold Finger angle

15° 30° 45° 60°

Certificate 

ROHS,  ISO9001:2008,  SGS,  UL certificate.