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Help Center2UUL FD40 BGA Chip Disassembly & Glue Removal Tool
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2UUL FD40 Precision Heating Platform for motherboard repair. This compact, lightweight station provides consistent thermal output, specifically designed for tasks requiring delicate glue removal from logic board components within a controlled temperature range of 150°C–200°C.
Features:
1. Specifically designed for softening and removing chip underfill; effectively lowers disassembly difficulty and reduces the risk of damage to chips and motherboards.
2. Utilizes an efficient heating block structure to ensure uniform heat transfer to the base of the chip, improving glue softening efficiency and repair stability.
3. The 16x17mm heating area is suitable for common ICs and BGA chips on mobile phone motherboards, enabling precise heating without affecting surrounding components.
4. Preheating to soften the underfill helps minimize issues such as pad detachment, circuit damage, and chip deformation caused by forced disassembly.
5. Suitable for BGA chip disassembly, reballing/rework, and pre-soldering preparation, thereby increasing the success rate of subsequent repairs.
Product Specifications:
Model: 2UUL FD40 Find 210 Chip Heating Glue Removal Station
Recommended Temperature Range: 150°C - 200°C
Heating Block Dimensions: 16x17mm
Product Dimensions: 90x23x5 mm
Packaging Dimensions: 130x39x11 mm
Net Weight: 7g
Gross Weight: 14.4g
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