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Help Center2UUL DW15 Solder Vampire Wick for CPU and Nand Tin Cleaning
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2UUL DW15 Solder Vampire Desoldering Wick for iPhone and Android logic board repair. The 2.0mm high-density braid provides efficient solder adsorption for cleaning BGA pads and removing tin from motherboard components during chip-level welding.
2UUL DW15 Solder Vampire Desoldering Wire Features:
1. 2UUL DW15 2015 desoldering wick: 2.0mm width, 1.5m length.
2. Fast tin absorption speed, strong cleaning power, resistant to oxidation corrosion, good thermal conductivity, and clean tin absorption.
3. Made of pure copper with precise geometric shapes, it greatly reduces the damage of thermal conductivity to the circuit board.
4. Refined chemical formula, low residue and corrosion resistance, no need for flux, directly absorbs excess solder.
5. Strong flexibility, can fit into narrow spaces, avoiding damage to electronic components such as chips or PCB boards.
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