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Help CenterMIJING Temperature Solder Paste for Mobile Device and Chip-Level Welding
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The MIJING High Purity Tin Paste serves as a solder paste for mobile phone motherboard, electronic circuit board, and BGA chip welding repair. Featuring a large mouth bottle for easy use, it is lead-free and silver-free, provides high, medium, and low temperature options with various melting points, and is suitable for various electronic motherboard BGA chip soldering and repair.
Features:
1. MIJING 138℃ 158℃ 183℃ 199℃ High Purity Tin Paste, 50G per box.
2. Square mouth design, easy to use, easy to recycle excess solder paste, reducing waste.
3. Lead-free and silver-free, high medium and low temperature solder paste, with various melting points.
4. More stable welding, reducing the problem of false soldering.
5. Suitable for mobile phone motherboard/electronic circuit board/BGA chip welding repair.
6. Suitable for various electronic motherboard BGA chip soldering and repair.
7. It is a necessary solder paste for daily mobile phone repair.
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