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Help CenterMECHANIC M35 High-Activity Flux Paste for Mobile Phone Motherboard Reballing
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Mechanic M35 10CC nano flux paste is designed for mobile phone motherboard BGA chip soldering repair. Using an environmentally friendly imported formula, it offers 98% new high activity with high efficiency and synergistic properties, including top 6 exclusive welding performance features. The paste is suitable for electronic product motherboard and chip repair and fluxing tasks.
Features:
1. Pure formula impurities are free, transparent and delicate in and out.
2. New imported formula, innovation ingredient, challenge Ice extreme purity.
3. High welding performance, new upgrade, low fogging, cleaning free, good deoxidizing.
4. Tight sealing without leakage, transparent and delicate, double sealing, fine/small/medium needles available.
Please note that the paste flux can only be sent out by special post (post mail).
Product Parameters:
Name: Mechanic M35 Nano flux paste
Size: 182x30x35MM
Packing: 187x3131MM
Capacity: 10CC
Needle: 3pcs
Package Lists:
3 x Needles
1 x Solder paste
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