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Help CenterMECHANIC R300 Desoldering Wire for Mobile Phone Circuit Board Solder Removal
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Mechanic R300 Desoldering Wire provides 1.0/1.5/2.0/2.5/3.0/3.5/4.0mm sizes of low residue, ultra-powerful solder wick for mobile phone PCB BGA circuit board repair. It operates as a BGA desoldering sucking wire.
Features:
Quickly removes unwanted solder when used with a soldering iron.
Efficient tin removal soldering wire, Low Residue / Powerful Cleaning / Fast Soldering / Oxidation Resistant / Corrosion Resistant, suitable for cleaning PCB boards and other solder.
Only touch the grip and the pack of desoldering wick when desoldering. Failure to do so will result in serious burns.
To avoid fire, never use a soldering iron and desoldering wick around combustibles or in an explosive environment.
Do not force the tip against the desoldering wick to avoid injury to yourself and/or damage to the parts and PCB.
Do not heat the desoldering wick for more than 5 seconds to avoid damage to the parts and PCB.
Specification:
Use: Used to remove excess solder
Features: Anti-oxidation,anti-corrosion.
Type: Solder Wick Remover
Package weight: about 8g
Length: 1.5 m
Width : 1.0mm 1.5mm 2.0mm 2.5mm 3.0mm 3.5mm 4.0mm
Material: Copper
How Use:
Place the desoldering wick over the solder to be removed, then push the heated soldering. iron tip onto the desoldering wick. The solder will be absorbed.
Remove the desoldering wick after the solder has been absorbed.
Cut off the used section of the wick using nippers.
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