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Help CenterYCS M.Y 005 Heat-resistant Magnetic Tin Pad for CPU BGA IC Soldering
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Description
YCS M.Y 005 Shenglong Magnetic Tin Planting Pad Heat-resistant Soldering Mat for 0.35mm 0.45mm 0.55mm 0.65mm BGA chips reballing repair. YCS Shenglong Pad Universal super-strong magnet soldering mat for mobile phone repair, PCB CPU IC BGA reballing, etc.
Features:
1. YCS M.Y 005 Heat-resistant Magnetic planting tin silicone mat with 0.35mm 0.45mm 0.55mm 0.65mm slot for mobile phone motherboard CPU NAND Chip BGA reballing soldering repair.
2. Four chip slots in multiple grids meet the tinning of chips of various thicknesses and specifications, and multiple slots are widely used.
3. The strong magnetic adsorption steel mesh will not fall off even if it is thrown wildly. The strong magnetic design makes the steel mesh not easy to fall off and shift, and the tinning is more firm and stable.
4. The heat dissipation holes on the back design prevent the steel mesh from bulging during tinning. The heat dissipation holes design prevents the steel mesh from bulging during tinning, and the strong magnetic adsorption steel mesh is also not easy to shift.
5. No bubbling, high temperature resistance, strong magnetic tin pad, easy to adsorb tin planting net BGA stencil.
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