2-layer ultra-thin ultra large size PCB,Ultra thin multi-layer PCB

Product field: Radar antenna

Material: FR-4, TG150

Finished product size: 1990 * 995.0mm

Layers: 2-layer ultra-thin ultra large size PCB

Copper thickness: 18um,

Minimum line width and spacing 8/6mi

Minimum hole: 0.25mm

Surface treatment: silver deposition

Finished product thickness 0.15mm

Main Product Structure of Chaosheng Group Company

2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production

Chaosheng Group Company mainly produces product categories

High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc.

The main application areas of PCB and PCBA products of Chaosheng Group Company

Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields;

The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company

Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles, automotive instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment, backlight sources, modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace, national defense and other product fields.

Process Capability Table
Technical ltem		MassProduct	Advanced Technology
		2015	2021	2025
Max.Layer Count		80 layer	100 layer	100 layer
PCB through hole board		2～80 layer	2～100 layer	2～100 layer
Maximum size through hole 1～2		37〞*98.50"	43.3〞*118.11"	43.3〞*118.11"
Minimum line width and spacing		10(0.40)	10(0.40)	7.50（0.30mm）
Minimum mechanical hole(mm)		12(0.50)	10(0.40)	8.50（0.35mm）
Maximum size through hole 4～22 layers		37〞*43.30"	43.3〞*43.30"	43.3〞*43.30"
Maximum size through hole 4～22 layers		31.50 ″*59"	31.50 ″*70.86"	31.50 ″*70.86"
Maximum size through hole 4～22 layers		10(0.40)	10(0.40)	7.50（0.30mm）
Minimum line width and spacing for multi-layer large-sized PCBs		10(0.40)	10(0.40)	7.50（0.30mm）
Maximum size of multi-layer through- hole : 4-22 layers with the smallest hole		12(0.50)	10(0.40)	8.50（0.35mm）
Maximum size HDI 4～36 layers		31.50 ″*55"	31.50 ″*55"	31.50 ″*55"
Minimum line width and line spacing of large size PCB		Through hole 12 / 12milHDI14 /14mil	Through hole 10/10 milHDI12 / 12mil	Through hole 8 / 8milHDI12 / 12mil
The largest board ruler 1 → the smallest hole of 18 layers		Through hole 0.50mmHDI :0.45mm	Through hole 0.50mm HDI : 0.45mm	Through hole 0.50mmHDI : 0.45mm
The layer number of FPC		1～36layer	1～60layer	1～60layer
Maximum size of flexible FPC		19.68〞*55"	28〞*59"	31.49〞*118.12"
Maximum size of flexible FPC with soft hard combination		19.68〞*55"	28〞*59"	31.49〞*118.12"
FPC (roll to roll) maximum size		19.68 ″*7874"	19.68 ″*7874"	19.68 ″*7874"
Maximum size of FPC single chip shipment		19.68 ″*118.11"	19.68 ″*196.8"	19.68 ″*196.80"
The layer number of FPC		2～18 layer	2～36 layer	2～42 layer
Maximum size of layered board		19.68 ″*35"	19.68 ″*43"	19.68 ″*43"
Number of through-hole layers		2～20layer	2～30 layer	2～40 layer
Hard and soft HDI layers		2～14 layer	2～18 layer	2～22 layer
Maximum size of soft and hard combination		19.68 ″*43"	19.68 ″*49"	19.68 ″*49"
FPC/soft-hard combination arbitrary interconnection HDI		4+X+4Interconnect HDI	5+X+5Interconnect HDI	6+X+6Interconnect HDI
HDIPCB layers		4～36layer	4～60layer	4～80 layer
Anylayer HDI PCB		4+X+4Interconnect HDI	5+X+5、Interconnect HDI	8+X+8、Interconnect HDI
HDIPCB maximum board size		24"*52"	43"*49"	43"*49"
Number of through hole layers of high frequency board		2～18 layer	2～36 layer	2～60 layer
HDI layers ofhighfrequency board		2～16 layer	2～24 layer	2～60layer
Maximum size of high frequency board		37 ″*43"	43 ″*49"	43 ″*49"
Number of ceramic plates		1-2 layer	1～4 layer	1～6 layer
Ceramic plate thickness		0.60mm-1.60mm	0.38mm-20.0mm	0.38mm-20.0mm
Maximum size of ceramic plate		100*150mm	150*190mm	150*650mm
Minimum aperture of ceramic plate		0.50mm	0.35mm	0.35mm
Minimum line width and line spacing of ceramic board		16/16mil	12/12mil	10/10mil
Number of layers of metal copper substrate		1-2 layer	1～4 layer	1～6 layer
Maximum line width and line spacing of metal iron substrate		12/12mil	4/4mil	4/4mil
Number of layers of metal aluminum substrateHDI		1-2 layer	1～4 layer	1～6 layer
Maximum size of metal substrate		37 ″*43"	25.59 ″*59"	25.59 ″*59"
The smallest hole of the metal substrate		0.50mm	0.35mm	0.35mm
Minimum line width and line spacing of metal substrate		8/8mil	4/4mil	4/4mil
Transparent FR-       4 material layers		1-2layer	1-2layer	1-8layer
Transparent FR-4 minimum hole		0.35mm	0.35mm	0.35mm
Transparent FR-4 minimum line width and spacing		4/4Mil	4/4Mil	3.5/3.5Mil
Transparent FR- 4 maximum size		23.63*47.25″	23.63*47.25 ″	23.63*47.25 ″
Number of tempered glass base layers		1-2layer	1-2layer	1-2layer
Minimum line width and spacing of glass		4/4Mil	4/4Mil	3.5/3.5Mil
The smallest hole in glass		0.35mm	0.35mm	0.35mm
Maximum size of glass		23.63*47.25″	23.63*47.25 ″	23.63*47.25 ″
Number of layers of transparent PETmaterial		1-2layer	1-2layer	1-2layer
Maximum size of transparent PET		19.68 ″*7874"	19.68 ″*7874"	19.68 ″*7874"
The company's main product types		Halogen free materials, high TG materials, high-frequency materials, high-speed materials, metal materials, glass materials, embedded materials, transparent FR- 4 materials, high thermal conductivity metals, high thermal conductivity aluminum substrates, environmentally friendly circuit boards, BT materials, ABF materials, and other imported materials, DU busbars, iron-based and metal based (core) mixed pressure plates, embedded buried copper, buried resistors, buried capacitors, buried ceramic bead plates, buried ceramics, ceramic mixed pressure plates, multi-layer ceramics, ultra-thin BT plates, ultra-thin PCBs, ultra-thin PCBs, multi-layer aluminum substrates, multi-layer ceramic plates, multi-layer ultra-thin HDI、  High frequency mixed voltage, differential impedance board, thick copper plate, gold-plated plate, high and low copper, high and low copper, high carbon resistance, transparent multilayer, glass plate, HDI arbitrary order (cross blind buried) Anylayer, flexible double-sided, flexible multilayer, soft hard combination HDI, roll to roll FPC, ultra long size, ultra large size board (single, double, multi-layer) PCB production and product design, product development, software development, etc
Main material		Rogers, Taikoni, Yaron, Mitsui, Isola, 3M, Taiyao, Taiguang, Tenghui, Shengyi,Lianmao, Nanya, Doosan, DuPont, Taihong, Hongren, Xinyang, Nippon Steel, Teflon,Yasen, Panasonic, RCC, Mitsui, Mitsubishi, Yingye, 3M, Kyocera, Jiuhao, Zhongci,Huaqing, Aishengda, Sliton, Kaichangde, Tongxin, Beige, Yalong, Taikoni,Hitachi, Laird System, etc
Main material categories		Halogen-free、halogenated、  high thermal conductivity, high TG135 、TG140、  TG150、  TG170、TG180、TG240、TG320
Build-up Material		FR-4 ，TG150,TG70,TG180
Conventional    plate  thickness     (mm)	Min.1-2L(mm)	0.10mm	0.10-12.0mm	0.10-18.0mm
	Min.4-10L(mm)	0.35mm	0.35mm～10.0mm	0.35-18.0mm
	Min.12L(mm)	0.43	0.38～10.0mm	0.38～18.0mm
	Min.16L(mm)	0.53	0.45～10.0mm	0.45～18.0mm
	Min.18L(mm)	0.63	0.51～10.0mm	0.51～18.0mm
	Min.52L(mm)	0.8	0.65～10.0mm	0.65～18.0mm
	MAX(mm)	3.5	12.0mm	18.0mm
Copper plate thickness and copper thickness	1-2 layerCU	700um	875um	875um
	Layers 4-20	4-12layer	4-16layer	4-22layer
	Inner layer copper thickness（um)	875um	1050um	1225um
	Outercopperthickness	210um	350um	525um
	Thick copper finished plate thickness	8.0mm	12.0mm	18.0mm
IC substrate	layerHDI	1-10layer	1-14layer	1-16layer
	Line width and spacing	50um	25um	15um
	copper thickness	8-10um	10-12um	12-15um
Min.CoreThickness um(mil)		254" (10.0)	0.15～254(10.0mm)	0.15～254(10.0mm)
Min.Build up Dielectric		38(1.5)	25(1.0)	25(1.0)
BaseCopperWeigh t	Inner Layer	1/4-8 OZ	1/4-0.30mm	1/4-0.30mm
	Out Layer	1/4-10 OZ	1/4-30 OZ	1/4-30 OZ
Gold thick		1～40u"	1～200u"	1～200u"
Nithick		76～127u"	1～250u"	1～250u"
Min.HOle/Land um(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)
Min.Laser via/landum(mil)		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)
Min. IVH、Hole size/landum(mil)		150/300(6/12)	100/200(4/8)	100/200(4/8)
DieletricThickness		38(1.5)	32(1.3)	32(1.3)
		125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes
viaoNhie(laserviaon BuriedPTH)		Yes	Yes	Yes
Laser Hole Filling		Yes	Yes	Yes
Technicalltem		MassProduct	Advanced Technology
Hole depth/diameter	Through Hoie	25:01 :00	35:01 :00	40:01 :00
AspctRatio	MicroVia	0.8 :1	0.8 :1	0.8 :1
copperFilling Dimple Size		10(0.40)	5(0.20)	5(0.20)
Minimumouter line width/ spacing	Inner layer line width and spacing	38/38(1.5/1.5)	38/38(1.5/1.5)	38/38(1.5/1.5)
	PlatedLayerum(mil)	38/38(1.5/1.5)	38/38(1.5/1.5)	38/38(1.5/1.5)
BGAPitchmm(mil)		0.4	0.4	0.4
PHMin.Hole rlng um(mil)		75(3)	62.50(2.50	62.50(2.50
Line Width control	<2.5mil(mil)	±0.50	±0.50	±0.50
	2.5mil≤L/W<4mil	±0.50	±0.50	±0.50
	≤3mil(mil)	±0.60	±0.60	±0.60
SolderMask Registration um(mil)		±25	±25	±25
Solder masThickness	Lines Minum(mil)	10(0.40)	10(0.40)	10(0.40)
	Lines Minum(mil)	30(1.20)	30(1.20)	30(1.20)
	CopperMinum(mil)	10(0.40)	10(0.40)	10(0.40)
	CopperMax um(mil)	30(1.20)	30(1.20)	30(1.20)
Mln.Solder Mask opening um(mil)		250(10)	200(8)	200(8)
Structure	Stacking layer by layer	5+N+5	6+N+6	7+N+7
	Sequenetlal Bu il-up	42Any Layer	46Any Layer	60Any Layer
	Stacking layer by layer	N+N	N+N	N+N
		N+X+N	N+X+N	N+X+N
	Sequenetlal Lamination	4+(N+X+N)+4	5+(N+X+N)+5	6+(N+X+N)+6
Multi-layer stepped structure	Multi- layer stacking	5+N+5	6+N+6	7+N+7
	Sequenetlal Bu il-up	12Any Layer	16Any Layer	18Any Layer
	Multi- layer staircase	4 steps	6 steps	6 steps
Mechanical depth control drilling depth		2.0mm±0.08mm	2.0mm±0.08m	2.0mm±0.08m
Laser controlled depth drilling		0.6mm±0.08mm	0.8mm±0.08mm	1.0mm±0.08mm
/Min.HOle/Land um(mil)	linner um(mil)	150/300(6/12)	100/200(4/8)	100/200(4/8)
	Outer um(mil)	150/300(6/12)	100/200(4/8)	100/200(4/8)
Minimumburiedholediameter/solder pad		60/170(2.4/6.8)	50/150(2/6)	50/150(2/6)
SUBDielectricThic      kness	Mln.um(mil)	38(1.5)	32(1.3)	25(1.0)
	Max.um(mil)	125(5)	125(5)	125(5)
SKipvia		Yes	Yes	Yes
Via on hole(LaserViaon BuriePTH		Yes	Yes	Yes
Laser Hole Filling		Yes	Yes	Yes
Resin plug hole plate thickness	Min mm(mil)	0.35	0.35	0.35
	Max mm(mil)	3.2	3.2	3.2
Min mm(mil)		125(5)	110(4.50)	110(4.50)
Routing Depth control Accuracy um(mil)		±50um(mil)	±50um(mil)	±50um(mil)
Outine NC Rcuting Tolerance um(mil)		75(3)	75(3)	75(3)
Type of surface Finishing		OSP、  Sinking gold, lead-free tin, lead tin, electroplated gold fingers, electroplated gold (electroplated nickel hard gold, electroplated nickel soft gold), gold fingers+sinking gold, spray tin+gold fingers, OSP+electroplated gold, OSP+sinking gold, electroplated silver, electroplated silver, electroplated tin, gold coated silver, nickel free electroplated thick gold, nickel free electroplated thick silver, tin silver copper, OSP+gold fingers
EN Thickness Control(um)		>0.025-0.1um	>0.025-0.1um	>0.025-0.1um
OSOSP Thickness(um)		>0.20-0.50um	>0.20-0.50um	>0.20-0.50um
Ni Thickness(um)		>105⇢ 250um	>105⇢ 250um	>105⇢ 250um
Platinum thickness control		>0.025-5um	>0.025-5um	>0.025-5um
Lead/lead- free tin spraying thickness		>105⇢ 150um	>105⇢ 150um	>105⇢ 150um
Electrosilver		>105⇢ 140um	>105⇢ 140um	>105⇢ 140um
Thickness control of sinking silver		>105⇢ 140um	>105⇢ 140um	>105⇢ 140um
Tin thickness control		>105⇢ 140um	>105⇢ 140um	>105⇢ 140um
Min TestPAD	E/Tum(mil)	75(3)	75(3)	75(3)
	E/Tum(mil)	50(2)	50(2)	50(2)
	E/Tum(mil	25(1)	25(1)	25(1)
	E/Tum(mil)	150（6）	150（6）	150（6）
lmpedanceContro lTolerance	≧50ohm	± 10%	±8%	±8%
	≦50ohm	±50ohm	±50ohm	±50ohm
Finished board	Plate thickness≧0.15mm	≧ ± 10%	≧ ± 10%	≧ ± 10%
	Plate thickness≧0.15mm	≧ ±0.075%	≧ ±0.075%	≧ ±0.075%
Warpage		≤0.7%	≤0.5%	≤0.5%
The above are the conventional production skills of Chaosheng Group Company, and there are any unclear points. Please further communicate with our specialized technical personnel, and we will be happy to serve you! Welcome to our guide!

FAQ

Question Point Answer

Q: What information is required for PCB CEGSATE: Gberber files for PCB production, product process instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagram for advanced products, copper thickness requirements for each layer, sample quantity requirements, batch order requirements, product application fields, and other related information are required

Q: What information does PCBA need to provide CEGSATE: BOM report is required (including the brand, specifications, and model of the components), X and Y coordinate numbers of PCBA components, and processing requirements: Do we need to purchase the components on our behalf? Or customer supplied components? Do you need software burning? What is the required quantity? What is the monthly demand and other detailed information.

Question: Is my file secure? CEGSATE: Your files are very secure, and we protect intellectual property rights for our clients throughout the entire process. All files provided by the customer will never be shared with any third party.

Q: What is the minimum order quantity? CESGATE: There is no minimum order quantity in POE. We are able to handle small and large batches flexibly.

Q: Do you have any other services? CESGATE: We mainly focus on PCB+FPC production+SMT+assembly PCBA+component procurement services; In addition, we can also provide programming, testing, software burning, wiring, and shell assembly services; And product design, product development, software development

Q: What is your inspection method? How do you control the quality? CESGATE: In order to ensure the quality of PCB and FPC products, flying pin testing is usually used for samples and small batches; The inner circuit undergoes AOI optical inspection, online AOI inspection, and the finished product undergoes 100% inspection through E-SET testing rack. The appearance undergoes 100% inspection through fully automatic finished product inspection equipment and FQC. PCBA undergoes automatic optical inspection (AOI), BGA part X-Ray 100% radiographic inspection, and first article inspection (FAI). PCBA products that require software burning undergo 100% full testing through finished product testing rack according to product functional requirements.