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Home > Electrical & Electronics > Electrical Control System > SHINKAWA MP-2W2 Machine Protection Monitor

SHINKAWA MP-2W2 Machine Protection Monitor

Guizhou Yuanmiao Automation Equipment Co., Ltd.

1Yr

SHINKAWA MP-2W2 Machine Protection Monitor thumbnail-1

SHINKAWA MP-2W2 Machine Protection Monitor photo-1

Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)

Key Specifications

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Material:

Other, Global universal model

Condition:

Other, Global universal model

Task:

Other, Global universal model

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Port of Shipment:

China

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Material Other, Global universal model

Condition Other, Global universal model

Task Other, Global universal model

Mathematical Model Other, Global universal model

Signal Other, Global universal model

Customized Non-Customized

Structure Other, Global universal model

SHINKAWA MP-2W2I. Overview

The SHINKAWA MP-2W2 is a high-precision semiconductor packaging equipment primarily used for die bonding processes, suitable for packaging flows of semiconductor products such as integrated circuits (IC), power devices, and optoelectronic components. The equipment adopts servo motor drive and visual positioning systems, enabling fully automated operations from wafer picking to substrate bonding. It features high speed, high precision, and high stability, widely applied in mid-to-high-end production lines of semiconductor packaging test factories and electronic manufacturing enterprises. The equipment supports various chip sizes (as small as 50μm×50μm) and substrate types, optimizing production efficiency through modular design to meet the refined needs of semiconductor packaging.

II. Functional Features

High-Precision Bonding Capability: Bonding accuracy reaches ±10μm (3σ), with repeat positioning accuracy of ±5μm, suitable for precision components like flip chips and thin-film chips to meet high-density packaging requirements.
High-Speed Production Efficiency: Maximum bonding speed up to 20,000 points/hour (depending on chip size and process requirements), supporting parallel picking and bonding of multiple chips to shorten cycle time.
Visual Positioning System: Equipped with high-resolution optical cameras (e.g., 5MP) and image processing algorithms, capable of real-time identification of chip marks (Mark points) and substrate pads, automatically compensating for mechanical errors to improve bonding consistency.
Multifunctional Picking Module: Supports multiple picking methods such as vacuum adsorption and electrostatic adsorption, compatible with chips of different materials and thicknesses (e.g., silicon wafers, ceramic chips), and allows replacement of nozzles with different specifications.
Intelligent Process Control: Integrates closed-loop control of multi-parameters including pressure, temperature, and time. Bonding pressure adjustable range: 0.1-5N, temperature control accuracy: ±2℃, ensuring welding strength and reliability.
Human-Machine Interaction and Monitoring: Equipped with a 15-inch touchscreen operation interface, supporting real-time adjustment of process parameters, production data statistics (e.g., yield, capacity), and fault early warning, compatible with data docking of factory MES systems.

III. Technical Parameters

Parameter Category	Specific Indicators
Bonding Range	X/Y axis stroke: 300mm×300mm, Z axis stroke: 50mm, θ axis rotation range: ±10°
Motion Accuracy	X/Y axis positioning accuracy: ±10μm, repeat accuracy: ±5μm; Z axis positioning accuracy: ±5μm, repeat accuracy: ±3μm
Drive Mode	Servo motor + precision ball screw, linear motor (optional), maximum acceleration: 5G
Visual System	Camera resolution: 5MP (color/monochrome), field of view: 5mm×5mm (standard lens), positioning speed: ≤50ms/frame
Chip Size	Minimum picking size: 50μm×50μm, maximum picking size: 5mm×5mm (standard module), supported thickness: 5-500μm
Substrate Type	Supports ceramic substrates, PCB boards, lead frames, carrier boards, etc.
Bonding Force Control	Range: 0.1-5N, resolution: 0.01N, supports pulse and constant pressure modes
Heating Function	Substrate heating temperature: room temperature-250℃, accuracy ±2℃; nozzle heating temperature: room temperature-150℃, accuracy ±3℃
Air Source and Power	Compressed air: 0.5-0.7MPa, cleanliness ≥0.1μm; power supply: three-phase AC 200-240V, 50/60Hz, power consumption ≤5kW
Working Environment	Temperature: 23±3℃, humidity: 45%-65% (non-condensing), cleanliness: Class 1000 (ISO 7)

IV. Working Principle

The working principle of SHINKAWA MP-2W2 is based on a collaborative architecture of "visual positioning + servo motion + process control", with core processes as follows:

Wafer and Substrate Pretreatment
The wafer is fixed on the wafer stage by vacuum adsorption, and the substrate is placed on the substrate stage, with both positions calibrated by the visual system.
Chip Picking
The bond head descends to the wafer surface via the Z axis, picks up the chip by vacuum adsorption, and confirms the chip direction and integrity through vision. If there is offset, it is compensated by θ axis rotation.
Visual Positioning and Path Planning
High-resolution cameras capture chip Mark points and substrate pad Mark points, calculate offsets through image processing, and the system automatically generates optimal motion trajectories (e.g., linear interpolation, curve interpolation) to avoid mechanical interference.
Bonding Process Execution
The bond head carries the chip to the top of the substrate, the Z axis descends to the set height, and bonding (e.g., thermocompression bonding, ultrasonic bonding) is performed according to preset pressure, temperature, and time. Bonding force is real-time fed back and adjusted by a pressure sensor.
Closed-Loop Feedback and Quality Control
After bonding, visual re-inspection of pad alignment is conducted. If the error exceeds the threshold, an alarm is triggered; meanwhile, process parameters (e.g., pressure, temperature curves) are recorded for traceability and yield analysis.
Cycle and Automation
The equipment realizes automatic loading and unloading of wafers and substrates through conveyors or robotic arms, completes fully automated production with a PLC control system, and supports continuous operation of multiple batches.

V. Common Faults and Solutions

Fault Phenomenon	Possible Causes	Solutions
Excessive bonding position offset	1. Visual camera focus offset or lens contamination 2. Servo motor encoder failure 3. Mechanical transmission component wear	1. Recalibrate camera focus and clean the lens 2. Replace encoder or motor 3. Check wear of lead screws/guides and add lubricant
Chip picking failure	1. Insufficient vacuum negative pressure 2. Nozzle blockage or damage 3. Abnormal wafer thickness detection	1. Check vacuum pump and pipeline airtightness, replace filter 2. Clean or replace nozzle, adjust nozzle height 3. Recalibrate wafer thickness sensor
Abnormal thermocompression temperature	1. Heating element damage in the heating module 2. Temperature sensor failure 3. Cooling fan stop	1. Detect heating element resistance with a multimeter, replace damaged components 2. Calibrate or replace temperature sensor 3. Clean fan dust and replace the fan
Visual recognition timeout	1. Insufficient Mark point contrast 2. Light source brightness attenuation 3. Improper image processing parameter settings	1. Adjust light source angle or replace with high-contrast light source 2. Replace light source components 3. Optimize Mark point recognition algorithms (e.g., threshold, template matching parameters)
Equipment alarm shutdown	1. Overload protection triggered 2. Abnormal air pressure/voltage 3. Emergency stop button or safety door not closed	1. Check if mechanical load is stuck, restart equipment to clear the alarm 2. Detect air source pressure and power voltage, repair abnormalities 3. Confirm safety device status, reset the emergency stop button
Unstable bonding force	1. Air pressure fluctuation 2. Pressure sensor failure 3. Loose mechanical structure	1. Install a pressure regulator to stabilize air source pressure 2. Calibrate or replace pressure sensor 3. Tighten guides, lead screws, and other connectors