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Help CenterEmbedded Buried Copper PCB, Embedded Multi-layer Buried Copper PCB
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Main Product Structure of Chaosheng GroupPCB CompanyUS$ 2 - 3MOQ: 1000 Sets
Product Type: Automotive Communication System
Size: 68.2*38.6mm/1PCS
Product structure: 370HR+PP, 8-layer high-frequency mixed-pressure second-order HDI, minimum hole 0.10mm, plate thickness 1.60mm, nickel-palladium gold 2U",
Main Product Structure of Chaosheng Group Company
Production of 2-80 layer rigid circuit boards, 2-50 layer flexible circuit boards, and PCBA
Main product categories of Chaosheng Group Company
High end double-sided, multi-layer, flexible, high-frequency, HDI arbitrary interconnection, metal substrate, high thermal conductivity metal substrate, ceramic, cut into metal substrate, cut into buried capacitor, cut into thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll on roll FPC, long FPC, large-sized printed circuit board, halogen-free materials, high-frequency materials, high-speed materials Metal materials, environmentally friendly circuit boards, blind buried through-hole circuit boards, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU bus, iron-based and metal based (core) hybrid boards, embedded copper buried, buried resistance and capacitance ceramic bead boards, ultra-thin BT boards, ceramic substrates, IC carrier boards, high-frequency hybrid voltage, high-speed boards, differential resistance boards, thick copper plates, thick gold-plated plates, HDI, Anylayer in any order (cross blind buried), double-sided, multi-layer, HDIFPC, soft and hard HDI, Integrated OEM and ODM production factories for roll to roll FPC, ultra long FPC, ultra large PCB production and product design and development, software development, and special material printed circuit boards.
The main application areas of PCB and PCBA products of Chaosheng Group Company
Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlights, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, mold proof, music equipment, playback equipment, banking equipment, medical equipment Medical devices, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields;
The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group
CompanyHard disk drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical, instrument, driver, automotive, automotive instruments, automotive hard drives, drivers, CD drivers, medical equipment, medical equipment, LED light strips, military, aviation, aerospace, national defense and other product fields
serial number project Manufacturing capacity
1 Layers 1-80Floor
2 Maximum size of PCB 2500*1150mm
3 Maximum size of flexible FPC 500mm*100m
4 Maximum size of PCBA 1600mm*1000mm
5 Maximum size of FPCBA 500mm*100m
6 PCB Finished Thickness 0.15-12.0mm
7 Flexible FPC Finished Thickness 0.05-0.60mm
8 Finished copper thickness 12um-1075um
9 Laser Hole Minimum Finished Aperture 0.075mm
10 Minimum line width and line spacing 1.5mi/1.50mil
11 Through hole minimum finished diameter 0.15mm
12 Thickness Stack Aspect Ratio 1:35
13 by processing method VIA hole blind buried hole treatment: ink plug hole, resin plug hole, copper paste plug hole, VCP copper fill hole, silver paste plug hole, carbon oil plug hole, etc.
14 surface treatment Immersion gold, electro-nickel gold, electro-thick gold, immersion gold + OSP, electro-nickel-gold + immersion gold, electro-nickel-gold + immersion gold + OSP, electro-gold + OSP, immersion gold + gold finger, OSP + gold finger, lead-free spray Tin, lead-free spray tin + immersion gold, lead-free spray tin + gold finger, lead spray tin, OSP, immersion tin, immersion silver, electric silver
15 Main Substrate Brands Rogers, Arlon, Taconic, TP-2, Megtron, Neclo, Isola, F4B, 3M, Mitsui Group (Japan Mitsui / Mitsui グループ), Taiyao TUC, Taiguang EMC, Tenghui VT, Shengyi SY, Lianmao ITEQ, Nanya NOUYA, DuPont Kapton, Taihong Taihong, Hongren Hongren, Xin Yang Xin Yang, Nippon Stee, Teflon, Yasen Yasen, Matsushita Matsushita, Japan RCC, Japan Mitsui Mitsui Group (Japan Mitsui グループ), 3M (3M Location) in the United States, Kyocera CERADIR in Japan, Jiuhe in Taiwan, Jiuhao in Taiwan, China Porcelain in China, Huaqing Huaqing, Ai Shengda, Slitton, Kai Changde, Tongxin Tongxin, Berger Bergs, Yalong, Taiconie, etc. Taiconieta
16 Solder mask color Green, Black, Red, Yellow, White, Blue, Purple, Matte Green, Matte Black, etc.
17 test service AOI, X-Ray, withstand voltage test, short pass test, solder test, thermal shock test, functional test, high temperature and humidity test, first article tester, etc.
18 Forming method CNC shape, die punch shape, V-CUT+ molding method
19 Finished warpage ≤0.5%
20 Mechanical Bore Tolerance ≤0.025mm
21 Finished warpage ≤0.5%
22 MiNiLED Minimum PAD 0.065mm/0.065mm
23 Thermal Conductivity ≧8W
24 The highest pressure 2500Pa
25 High carbon resistance value and tolerance ≧100→15000Ω±20%
26 Impedance tolerance ≤5→8%Ω
27 IC carrier substrate series Minimum line width and line spacing 20um/20um
FAQ
Question point answer
Q: What information does the PCB need to provide? CEGSATE: It is necessary to provide the Gberber file for making PCB, the product process production instructions, such as material requirements, surface treatment requirements, finished product thickness requirements, PCB stack structure diagrams for high-end products, copper thickness requirements for each layer, sample quantity requirements, and bulk order requirements , product application fields and other related information
Q: What information does PCBA need to provide? CEGSATE: It is necessary to provide BOM report (requires the brand, specification and model of the component), X, Y coordinate number of PCBA components, and processing requirements: Do you need us to purchase components? Or customer-supplied components? Is software burning required? How much is required? Details such as what is the monthly demand.
Q: Are my documents safe? CEGSATE: Your documents are very secure and we protect intellectual property for our clients throughout the process. All files provided by customers will never be shared with any third party.
Q: How much is the MOQ? CESGATE: There is no MOQ in POE. We have the flexibility to handle both small and large batches.
Q: Do you have other services? CESGATE: We mainly focus on the procurement services of PCB+FPC production+SMT+Assembly PCBA+components; in addition, we can also provide programming, testing, software programming, wiring, shell assembly services; as well as product design, product development, software development
Q: What is your inspection method? How do you control the quality? CESGATE: In order to ensure the quality of PCB and FPC products, samples and small batches are usually detected by flying probe; the inner layer circuit passes AOI optical inspection, online AOI inspection, the finished product is 100% tested by E-SET test frame, and the appearance is fully automatic Finished product inspection equipment 100% full inspection and FQC 100% full inspection, PCBA automatic optical inspection (AOI), BGA parts X-Ray 100% ray inspection, first article inspection (FAI), PCBA products that require programming software, according to product functional requirements, 100% full test through the finished test frame, etc.
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