16 Layers, 5 Steps, Multi-layer PCB With 5 Steps
FR-4, TG170, 16 layers, 5 steps, 5 steps, minimum hole 0.10mm, distance between each step 3.0mm, height of each step 0.30mm, finished plate thickness 2.95mm, red solder mask, white lettering, 2U sinking gold“
100AOI, 100% testing
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