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Help CenterInfrared Soldering BGA Rework Station With Laser Positioning Technology
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Infrared Soldering BGA Rework Station with Laser Positioning Technology
Model:LV-08
v Repair Success Rate:More Than 99%.
v Using The Industrial Touch Screen.
v Independent 3 Heating Zones, Hot Air Heating / Infrared Preheat. (temperature accuracy ± 3℃).
v With CE Certification.
Specification :
1 |
Power |
AC 220V±10% 50Hz |
2 |
Overall dimension |
L660mm*W640mm*H870mm |
3 |
PCB jigs size |
Max 460mm*380mm Min 10mm*10mm |
4 |
Chip magnification |
1-200 times |
5 |
Applicable chips |
0.8mm-6cm |
6 |
Weight of machine |
70KG |
7 |
Warranty |
1 year |
8 |
Total power |
5300W |
9 |
Payment way |
T/T,Western Union,Paypal |
10 |
Usage |
Repair chips / phone motherboard etc |
11 |
Electrical material |
Touch screen+Temperature control module+PLC control |
12 |
Location way |
V-shape card slot+Universal jigs |
Packing & Delivery:
1, Standard Export Wooden cases
2, Delivery in 2 workdays after payment confirm;
3, Shipping by TNT,DHL,FEDEX , or by air or by sea
4, Loading port: Shenzhen or Hongkong.
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