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Product field: Backlight LED
Layers: LED strip with extra long FPC
Plate thickness: 0.15mm;
Size: 5000 * 250mm/850PCS
Process structure: Shengyi PI, non adhesive substrate, 15um/15um PI: 1/2 mil
Surface treatment: OSP
e treatment: Immersion Gold (ENIG)
Application: LED backlighting for electronic displays, signage, and lighting fixtures.
This Backlight LED product features an LED strip with an extra long flexible printed circuit (FPC) for easy installation and customization. The plate thickness is 0.15mm, making it lightweight and flexible for various applications. The size of each piece is 5000 * 250mm, with a total of 850 pieces in a set.
The process structure includes Shengyi PI material, which is a high-quality polyimide material known for its excellent thermal stability and electrical insulation properties. The non-adhesive substrate ensures a secure bond between the LED strip and the FPC, while the 15um/15um PI thickness provides a durable and reliable structure. The surface treatment of Immersion Gold (ENIG) enhances the conductivity and solderability of the product.
This Backlight LED product is suitable for use in electronic displays, signage, and lighting fixtures where a bright and energy-efficient light source is required. Its long FPC allows for easy installation in various shapes and sizes, making it a versatile solution for a wide range of applications.
Main Product Structure of Chaosheng Group Company
2-80 layers of rigid circuit boards, 2-50 layers of flexible circuit boards and PCBA production
Chaosheng Group Company mainly produces product categories
High end double-sided, multi-layer, flexible, high-frequency, HDI interconnect, metal based, high thermal conductivity metal based, ceramic, cut in metal based, cut in buried capacitor, cut in thick copper buried magnet, concave convex step substrate, 5G high-speed board, thick copper, thick gold, high carbon resistance, double-sided multi-layer MiNiLED, MiNiHDILED, MiNiOLED, IC carrier substrate, roll to roll FPC, long FPC, large-sized printed circuit board, halogen-free material, high-frequency material, high-speed material, metal material, environmentally friendly circuit board, blind buried hole circuit board, high thermal conductivity aluminum based, thermoelectric separation copper based, PDU busbar, iron-based and metal based (core) mixed pressure plate, embedded copper buried copper. Buried resistance buried capacitance buried ceramic bead board, ultra-thin BT board, ceramic substrate, IC carrier board, high-frequency mixed voltage, high-speed board, differential impedance board, thick copper plate, thick gold plated board, HDI An integrated OEM and ODM production factory for Anylayer, double-sided, multi-layer, HDI FPC, soft hard combination HDI, roll to roll FPC, ultra long FPC, ultra large size PCB production and product design and development, software development, special material printed circuit boards, etc.
The main application areas of PCB and PCBA products of Chaosheng Group Company
Communication terminals, communication stations, electronic communication, fiber optics, optical modules, backlight sources, chip systems, communication equipment, communication instruments, computers, intelligent devices, intelligent control, system control, industrial power control, industrial equipment, testing instruments, testing instruments, SD cards, SG cards, mobile phones, computers, various antennas, radars, automobiles, light sources, resistors, music equipment, playback equipment, banking equipment, medical instruments, medical equipment, aerospace, aviation, military, LED, OLED, OLCD power control power supply, industrial power supply, communication power supply, automotive power supply, office equipment, digital products, computers and other application fields;
The main application areas of flexible circuit boards (FPC) and FPCA products of Chaosheng Group Company
Hard drives, printers, fax machines, scanners, sensors, mobile phones, connectors, modules, walkie talkie antenna cards, high-end cameras, digital cameras, laser heads, CDs, medical devices, instruments, drives, automobiles, automotive instruments, automotive drive disks, drivers, optical drives, medical devices, medical equipment, backlight sources, modules, banking equipment, industrial instruments, LED light strips, military, aviation, aerospace, national defense and other product fields.
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