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manual multi-function die bonder eutectic and epoxy bonding in one system
- 10 Piece / Pieces per Month
- shenzhen
- T/T
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Product Details
Brand Name | HXWZ | Place of Origin | China | |
Model Number | DF-02 |
Product Description
DF-02 multi-function die bonding , an easy and quick tool for chip assembly, mostly used in laser devices, sensor chips bonding. can be used in epoxy or eutectic attach bonding.
Feature:
1 It have 3 positions for bonding tools or collets, can interchange quickly.
2 The tools can rotate 360 degree, easy to place any size of dies on pads under microscope.
3 The operating manipulator can be locked in any positions, which is more stable when doing some complex jobs.
4 The scrub stroke and speed can be ajusted .
5 The dispensing amount can be controlled accurately.
Contact Us
- Qingdao Lingtry Electronic Technology Company
- Contact nameEric Zhu Chat Now
- AddressShibei district, Qingdao, Shandong
Product Categories
test | wire bonding | die bonding |
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