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Home > Manufacturing & Processing Machinery > Manufacturing Equipment for Electrical & Electronic Product > Chip Mounter > Manual Eutectic Die Bonder and Epoxy Die Attach
Manual Eutectic Die Bonder and Epoxy Die Attach
Product Spotlights
easy to operate, good for R&D, institute low production. As it has multi funtion, and low cost, very good for start up company
US$ 26000 - 36000
MOQ: 1 Set
Key Specifications
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Type:
Medium-speed Chip Mounter
Warranty:
12 Months
Automatic Grade:
Manual
Payment & Shipping
Payment Methods:
Port of Shipment:
shenzhen
Delivery Detail:
60 days
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Type
Medium-speed Chip Mounter
Warranty
12 Months
Automatic Grade
Manual
Condition
New
Precision
Precision
Speed
Medium Speed
application
laser device
Trademark
LINGTRY
Origin
China
DF-02 multi-function die bonding , an easy and quick tool for chip assembly, mostly used in laser devices, sensor chips bonding. can be used in epoxy or eutectic attach bonding.
Feature:
1 It have 3 positions for bonding tools or collets, can interchange quickly.
2 The tools can rotate 360 degree, easy to place any size of dies on pads under microscope.
3 The operating manipulator can be locked in any positions, which is more stable when doing some complex jobs.
4 The scrub stroke and speed can be ajusted .
5 The dispensing amount can be controlled accurately.
6 constant temperature heating or pulse heating option, which is better for temperature sensitive device using.
Send Inquiry to This Supplier
Business Type
Trading Company
Year Established
2016
Annual Export Value
Below US$1 Million
Port of Shipment
Qingdao, shanghai, Xi'an
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