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Home > Electrical & Electronics > Semiconductor > Intrinsic Semiconductor > Manual Multi-function Die Bonder Eutectic and Epoxy Bonding in One System
Manual Multi-function Die Bonder Eutectic and Epoxy Bonding in One System
US$ 20000 - 30000
MOQ: 1 Piece
Key Specifications
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Brand Name:
HXWZ
Place of Origin:
China
Model Number:
DF-02
Payment & Shipping
Payment Methods:
Port of Shipment:
shenzhen
Delivery Detail:
Delivery time depends on order quantity.
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Brand Name
HXWZ
Place of Origin
China
Model Number
DF-02
DF-02 multi-function die bonding , an easy and quick tool for chip assembly, mostly used in laser devices, sensor chips bonding. can be used in epoxy or eutectic attach bonding.
Feature:
1 It have 3 positions for bonding tools or collets, can interchange quickly.
2 The tools can rotate 360 degree, easy to place any size of dies on pads under microscope.
3 The operating manipulator can be locked in any positions, which is more stable when doing some complex jobs.
4 The scrub stroke and speed can be ajusted .
5 The dispensing amount can be controlled accurately.
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Business Type
Trading Company
Year Established
2016
Annual Export Value
Below US$1 Million
Port of Shipment
Qingdao, shanghai, Xi'an
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