Sewage Treatment Plant

Electroplating Wastewater Sewage Treatment Plant for rotogravure cylinder making used in Engravured cylinder making and intaglio printing industry.Electroplating liquid wastewater include the pretreatment rinsing wastewater, plating rinsing wastewater. And the principal pollutants are heavy metal ion .

Electroplating rotogravure wastewater reuse technology means to add reclaimed water reuse system and reuse system on the basis of standardized discharge technology. The Gravure cylinder plating Sewage Treatment Plant effluent can meet reclaimed water reuse standards(such as cleaning).

1.1 Up-to-standard discharge technology The emission of Electroplating rotogravure waste water intaglio cylinder Electroplating wastewater which contains heavy metal ions such as Cr, Cu and Ni must meet the local requirements by adopting the means of "Physical and Chemical Reaction + Sequencing Batch Precipitation + Ion Exchange + Compulsory Filtration" to reach the standard.

1.2 Engravure printing roller Electroplating wastewater reuse technology

1.3 Electroplating engravured wastewater zero-discharge technology MVR evaporator Working principle: MVR evaporator will increase the energy of secondary steam by using compressor, and will take advantage of the secondary steam with improved energy to recycle the potential heat of secondary steam. Specifically: Increase the pressure and temperature of the secondary steam generated by evaporator through the adiabatic compression in compressor, and after that, the steam will be fed into the heating chamber of evaporator (heat exchange system) as the heating steam, thus the potential heat of steam can be reused Engravured cylinder Sewage Treatment Plant . The cold material will absorb the heat of non-condensable gas through preheating exchanger before being sent into evaporator, so the temperature of the cold material will increase, meanwhile, the Auto intaglio copper tank condensate can be cooled by this material. This can further improve the utilization ratio of heat.