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XZZ Lead Free Tin Paste 138/158/183/199℃ Solder Flux

XZZ Lead Free Tin Paste 138/158/183/199℃ Solder Flux photo-1
XZZ Lead Free Tin Paste 138/158/183/199℃ Solder Flux photo-2
XZZ Lead Free Tin Paste 138/158/183/199℃ Solder Flux photo-3
Negotiable MOQ: 1 Barrel (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
PHONEFIX
Place of Origin:
China
Model Number:
XZZ077
Payment & Shipping
Payment Methods:
Port of Shipment:
shenzhen
Delivery Detail:
Delivery time depends on order quantity.
Brand Name PHONEFIX
Place of Origin China
Model Number XZZ077
Description
XZZ Tin Paste 138℃ 158℃ 183℃ 199℃ Solder Flux For Mobile Phone iPad Tablet Logic Board PCB BGA SMD PGA Welding Desoldering Repair. XZZ low/medium/high temperature leaded/lead-free solder flux paste. 

XZZ Tin Paste 4 kinds temperature(Low/Medium/High ): 138℃, 158℃, 183℃, 199℃.

Option:
1. XZZ lead-free low-temperature solder paste 138℃.
2. XZZ lead-free medium-temperature solder paste 158℃, contains silver.
3. XZZ leaded medium-temperature solder paste 183℃, contains silver.
4. XZZ leaded high-temperature solder paste 199℃, contains silver.

Features:
1. No tin streak.
2. bright solder joints.
3. strong tin crawl.
4. Not easy to dry, less tinning, high yield rate.
5. Moderate viscosity, no slumping, no deflection. The paste is viscous and smooth, the viscosity change is small, the chip components are not easy to shift.


Product Tags: flux , Lead-free solder paste

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Port of Shipment
shenzhen
Main Markets
North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe, Central America, Northern Europe, Southern Europe, South Asia, Domestic Market