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8 Layers PCB With Blind Buried Vias
Negotiable
MOQ: 10 Pieces (Price negotiable depending on order volume and customization)
Key Specifications
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Surface Finishing:
ENIG
Min. Line Spacing:
4mils
Min. Line Width:
4mils
Payment & Shipping
Payment Methods:
Port of Shipment:
shenzhen
Delivery Detail:
Delivery time depends on order quantity.
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Surface Finishing
ENIG
Min. Line Spacing
4mils
Min. Line Width
4mils
Min. Hole Size
0.1mm
Board Thickness
1.6mm
Copper Thickness
0.5oz/0.5oz
Base Material
FR4
8 layers PCB with blind buried vias
Minimum line width/space: 4mils
Surface finish: immersion gold
Board thickness: 1.60MM
Minimum drilled hole diameter: 4mils
Copper thickness: 0.5oz
Special process : 0.25MM BGA , resin plugged vias in BGA pads
Send Inquiry to This Supplier
Business Type
Manufacturer
Year Established
1999
Port of Shipment
Shenzhen
Main Markets
North America, South America, Eastern Europe, Western Europe, Northern Europe, Southern Europe, South Asia
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