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8 Layers Impedance PCB With Vias in BGA Pads

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Negotiable MOQ: 10 Pieces (Price negotiable depending on order volume and customization)
Key Specifications
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Surface Finishing:
ENIG
Min. Line Spacing:
4mils
Min. Line Width:
4mils
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Shenzhen Cyzonpcb Eletronics CO,.Ltd
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Payment & Shipping
Payment Methods:
Port of Shipment:
China
Delivery Detail:
Delivery time depends on order quantity.

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Surface Finishing ENIG
Min. Line Spacing 4mils
Min. Line Width 4mils
Min. Hole Size 8mils
Board Thickness 1.2mm
Copper Thickness 0.5/0.5oz
Base Material FR4
Number of Layers 8-Layer

8 layers impedance PCB with vias in BGA pads

Minimum line width/space: 4mils

Surface finish: immersion gold

Board thickness: 1.20MM

Minimum drilled hole diameter: 8mils

Copper thickness: 0.5oz

Special process : 0.35MM BGA , resin plugged vias in BGA pads

 


Product Tags: multilayer pcb , 8layers , BGA , impedance

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Shenzhen Cyzonpcb Eletronics CO,.Ltd
Verified Business License
Business Type
Manufacturer
Year Established
1999
Port of Shipment
Shenzhen
Main Markets
North America, South America, Eastern Europe, Western Europe, Northern Europe, Southern Europe, South Asia
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