1. Can be used with 6-inch/8-inch Wafer ring input and tape&reel output;
2. Pick with one nozzle from wafer ring to carrier tape;
3. Mapping function is optional;
4. For 1.0 × 1.0 (mm) to 12 × 12 (mm) size die;
5. Suitable for QFN, CSP etc;
6. Carrier tape rail width fixed. One machine is for one spec carrier tape only;
7. HMI software has English language
Wafer to dicing tape|wafer tape and reel|bare die tape and reel machine|die sorting machine|wafer to waffle tray|die bonding
whatsapp +8615989403900
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