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Help CenterHow to Process High Quality Micro Hole Efficiently
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Semiconductor ceramics Ceramics with semiconductor properties and electrical conductivity of about 10-6 ~ 105S/m. The conductivity of semiconductor ceramics due to the external conditions (temperature, light, electric field, atmosphere and temperature, etc.) changes and significant changes, so you can change the physical quantity of the external environment into electrical signals, made of various uses of sensitive components. In recent years, with the development of 5G, materials such as single crystal silicon and ceramics have been more and more widely used in the field of semiconductors. The machined parts are developing towards precision and miniaturization, and the processing of precision micro holes has attracted more and more attention. It is generally believed that machining mechanical keyhole is difficult at home and abroad. As a common micro structure, micro hole is widely used in various parts, such as mobile phone, computer and other industries in the manufacturing of micro hole processing is a major difficulty. How to process high quality micro hole efficiently? Xiazhi technology latest research and development product PCD micro drill, the product has high hardness, high wear-resisting characteristics. The ideal drilling speed and life are obtained in the processing process, which meets the processing needs of small holes and fine deep holes.
Application
Suitable for monocrystalline silicon and quartz Ceramics, etc. are fragile and difficult to process Material drilling.
Advantage
φ0.1mm～φ2.0mm Any size according to customer needs;
Can be customized Fast product within 5～10 days Delivery capability;
This product has been large and stable Supply to Japanese and Korean companies.
Specification
Model |
Blade Diameter |
Balde Length |
Total Length |
Shank Diameter |
X020 |
0.2 |
6.0 |
38 |
3.175 |
X030 |
0.3 |
6.0 |
38 |
3.175 |
X040 |
0.4 |
7.0 |
38 |
3.175 |
X050 |
0.5 |
13.5 |
40 |
3.175 |
X060 |
0.6 |
13.5 |
40 |
3.175 |
X070 |
0.7 |
13.5 |
40 |
3.175 |
X080 |
0.8 |
13.5 |
40 |
3.175 |
X090 |
0.9 |
13.5 |
40 |
3.175 |
X100 |
1.0 |
13.5 |
40 |
3.175 |
Case
|
Size
|
Processing material
|
Type of cooling
|
processing method
|
finish depth
|
rotate speed
|
feed
|
Q-value
|
D0.2*2L*3.175D*38L |
Ceramic
|
oil cooling
|
Deep hole pecking
|
1.5mm |
30000r/min |
2mm/min |
0.005mm |
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