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Negotiable
MOQ: 1 Piece (Price negotiable depending on order volume and customization)
Key Specifications
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Brand Name:
King Sun
Place of Origin:
China
Surface Finishing:
Hard Gold Plating
Payment & Shipping
Payment Methods:
Port of Shipment:
Shenzhen
Delivery Detail:
Delivery time depends on order quantity.
Related Products
Brand Name
King Sun
Place of Origin
China
Surface Finishing
Hard Gold Plating
Board Thickness
3.8mm
Copper Thickness
1/1/1/1/1/1/1/1/1/1/1 OZ
Base Material
FR4 High Tg
Hard Gold Plating PCB:
Layers : 12 Layer
PCB Material: FR4 High Tg
Board Thickness: 3.8mm
Surface Finishing: Hard Gold Plating
Finished Copper thickness: 1/1/1/1/1/1/1/1/1/1/1 OZ
Special Process:
Hard gold thickness 30u”
HDI&Microvia(blindburied) PCB Capability:
| Minimum Circuit Trace Width/Space: 2.7/2.7mil |
| The Minimum Via Size : 0.1mm |
| The Minimum legend Height/Width: 0.5mm/0.12mm |
| Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin |
| Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling |
| Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide |
| Final Board Thickness: 0.4mm ~ 6.0mm |
| Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ |
| FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm |
| Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation |
| Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole |
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Business Type
Manufacturer
Year Established
2003
Annual Export Value
US$1 Million - US$1.5 Million
Port of Shipment
Shenzhen
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