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Help CenterFO 1200MESH Grinding Powder
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FO 1200MESH Grinding powder
Physical properties and Chemical composition
Item |
Size |
Specific Gravity |
Al2O3 |
SiO2 |
Fe2O3 |
TiO2 |
ZrO2 |
FO |
1200# |
≥3.90 |
≥45.0% |
≤20.0% |
≤0.5% |
≤2.0% |
≤33.0% |
PSD(Particle Size Distribution) of FO 1200MESH
Size |
D0 |
D3 |
D50 |
D94 |
#1200 |
≤23.0 |
≤20.0 |
7.1±0.7 |
≥4.0 |
Main Applications
--Grinding and polishing of semiconductor wafers
--Surface finishing of various optical glasses
--Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.
--Surface finishing of piezoelectric materials
Packing
10kgs pvc bags+pallet
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