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FO Grinding Mircopowder for Silica Wafer

FO Grinding Mircopowder for Silica Wafer photo-1
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Product Spotlights

China Manufacturer,good price and enough stock
US$ 23.99 - 29.99 MOQ: 1000 Kilograms
Key Specifications
Get Latest Price
Source:
Artificial Abrasives
Application:
Electronic
Hardness:
Conventional Abrasive
Payment & Shipping
Payment Methods:
Port of Shipment:
Tianjin/Qingdao Port
Delivery Detail:
5 days
Source Artificial Abrasives
Application Electronic
Hardness Conventional Abrasive
Artificial Abrasive Type Other, FO abrasives
Function Surface Finish
Particle Size Powder
Transport Package 10kgs pvc bags+pallet
Specification 800mesh-3000mesh
Trademark Haixu abrasives
Origin China

FO grinding mircopowder for silica wafer

微信图片_20260815095608_32_119

FO grinding mircopowder for silica wafer Physical properties and Chemical composition 

item

Size

Specific gravity

(g/cm3)

                                                            chemical(%)

       Al2O3

        SiO2

             Fe2O3           TiO2        ZrO2

FO

#800-#1200

              ≥3.90

      ≥45.0

       ≤20.0

              ≤0.5

           ≤2.0

     ≤33.0

#1500-3000

              ≥3.90

      ≤40.5

        ≤20.0

              ≤0.7

           ≤2.0

     ≤33.0

 PSD(Particle Size Distribution) of FO grinding mircopowder for silica wafer

                   Size

                   D0

                 D3

                     D50

                  D94

                  #800

               ≤32.0

               ≤27.0

                11.3±0.9

                 ≥6.5

                 #1000

               ≤27.0

               ≤23.0

                  9.4±0.8

                  ≥5.0

                 #1200

               ≤23.0

               ≤20.0

                  7.1±0.7

                  ≥4.0

                 #1500

               ≤19.0

               ≤17.0

                  5.5±0.5

                  ≥3.0

                 #2000

               ≤15.0

               ≤14.0

                  4.5±0.4

                  ≥2.0

                 #3000

               ≤12.0

                ≤11.0

                  3.6±0.4

                   ≥1.5

FO Main Applications

--Grinding and polishing of semiconductor wafers

--Surface finishing of various optical glasses

--Grinding and polishing of lenses, prisms, mirrors, filters, etc. of optical crystals.

--Surface finishing of piezoelectric materials

Packing

10kgs pvc bags+pallet


Product Tags: FO grinding silica wafer , FO grinding mircopowder for silica wafer , FO grinding mircopowder

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Verified Business License
Business Type
Manufacturer
Year Established
1999
Annual Export Value
US$50 Million - US$100 Million
Port of Shipment
Tianjin/Xingang, Qingdao, Lianyungang, QINZHOU

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