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High Performance Diamond Back Grinding Wheels For Silicon, Sapphire, GaN Wafer

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US$ 1 - 2 MOQ: 1 Piece
Key Specifications
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Brand Name:
MORE SUPER HARD
Place of Origin:
China
Model Number:
1A1
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More Super Hard Company
Payment & Shipping
Payment Methods:
Port of Shipment:
shanghai
Delivery Detail:
5 days

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Brand Name MORE SUPER HARD
Place of Origin China
Model Number 1A1
Size 300
Type Abrasive Disc

High Performance Diamond Back Grinding Wheels For Silicon, Sapphire, GaN Wafer

Vitrified bond diamond grinding wheel bond agent has higher strength; good wear resistance, sharp cutting Grinding efficiency is high, and easy to trim; generally suitable for silicon wafers, such as rough grinding, semi-finishing grinding, etc.

The diamond grinding wheel has good self-sharpening performance and is not easy to clog; the grinding efficiency is high, the grinding force is small, and the grinding temperature is low The bonding agent itself has good elasticity and polishing performance; the workpiece has high surface finish and good surface quality; it is suitable for fine grinding and polishing of silicon wafers.

 

The Specification Of Diamond Back Grinding Wheels:

Model

Diameter (Mm)

Thickness (Mm)

Hole (Mm)

 

6A2

175

30, 35

76

200

35

76

350

45

127

 

6A2T

195

22.5, 25

170

280

30

228.6

 

6A2T(Three Ellipses)

350

35

235

209

22.5

158

Other Size Can Ba Made According To Customers Requirements Email: @Moresuperhard.Com

 

silicon wafer back grinding wheel features:

1, surface quality: require grinding lines evenly, without chipping, debris, scribe, etc.;

2, processing accuracy: TTVμm etc. (Total thinning veracity);

3, processing quality: surface roughness:μm;

 

 

Application of back grinding wheel

The grinding wheels for LED substrate are mainly used for back thinning of sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Workpiece processed: sapphire epitaxial wafer, silicon wafer, gallium arsenide and GaN wafer.

Material of workpiece: synthetic sapphire, single crystal silicon, gallium arsenide and GaN materials. 

The LED substrate thinning grinding wheel is mainly used for the back surface thinning of the sapphire epitaxial wafer, silicon wafer, gallium arsenide and gallium nitride wafer in the LED industry. The grinding LED substrate grinding wheel developed by our company has superior grinding performance and high cost performance. It can be used stably in European, American, Japanese and domestic grinding machines, and can replace imported products. 


If you need any products, do not hesitate to contact

Annamoresupe@gmail.com

Anna.wang@moresuperhard.com

WhatsApp:+8615617785923

Skype:Annawng

Wechat:15617785923

QQ:1664333593

Mobile:+86-156177854923

Tel/Fax:+86-0371-86545906


Product Tags: Back Grinding of Wafers Diamond Wheels , Back Grinding Wheels , Vitrified bond , Back Grinding Diamond Wheels , Silicon Wafer Back Grinding Wheel , gridning wheel for wafers , Silicon Wafers , Back Grinding , for Thinning

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More Super Hard Company
Business Type
Manufacturer
Year Established
2010
Factory Size
1,000-3,000 square meters
Annual Export Value
US$1 Million - US$1.5 Million
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