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Help Center1A1, 1A8, 1A8S, 1E8, 1A1R Diamond Dicing Blade
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1A1, 1A8, 1A8S, 1E8, 1A1R Diamond Dicing Blade
dicing blades market
Electroplated Diamond Discs
10 cbn disc
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ehwa dicing blades
Ultra Thin Diamond Cutting Blade/Resin Bond Diamond Dicing Blades Without Steel Core
Resin dicing blades for sapphire cutting
Metal Diamond blades without steel plate
The dicing blades without steel core are made from diamond or cubic boron nitride and bonded with resinthrough special processes. Such blades are mianly used for cutting with high precision and slottingsemiconductor components, optical glasses, quartz glasses, ceramics, and other precision components.
Main feathers:
1.Minimized blade wear and high cutting ability.
2. High rigidity-minimized wavy and slant cutting.
3. Wide variety of bond types for various applications.
4. Able to precisely control diamond concentration to achieve cutting
Application:
can be used for cutting:
1. Semiconductor materials: Si, Ge, GaP, GaAs, GaAsP, BiSb, BGA, QFN, SiC, FQFN, solar battery and so on.
2. Ceramic materials: Al2O3, ZrO2, Si3N4, BaTiO3, CaTiO3 and so on.
3. Magnetic materials: Magnetic core, magnetic sheet and so on.
4. Metal materials: High speed steel, tool steel, die steel, bearing steel and so on.
5. Other materials: Glass, Crystal, electronic components and so on.
Application:
Ultra-thin super-hard material cutting wheel mainly used in the field of electronic information industry's electronic components and mechanical precision parts for cutting off and grooving.
Can be used for following material cutting:
1. Semiconductor materials
2. Oxide ceramic, and cemented carbide mate
Skype:Annawng
WhatsApp:+8615617785923
@moresuperhard.com
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