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Help CenterWL Intelligent Grinding Equipment For IPhone IC CHIP Repair
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WL Intelligent Grinding Equipment is professional iPhone IC chip repair machine, It is designed to grind and remove the CPU, Baseband, CHIP, HDD, WIFI, FONT chips in iPhone series mobile phone without any damage on the motherboard. The smart ic grinding machine for iPhone is very convenient to be controlled and operated with LCD touch screen instead of computer, it can offer great service in mobile phone repairing and refurbishing.
WL iphone IC Grinding Machine is perfect to grind and remove the CPU, Baseband, CHIP, HDD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone 6, 6 plus, 6S, 6S plus, 7, 7 plus. You can use the soldering station to solder a good chip in the board after grinding. Great grinding machine in mobile phone repairing and refurbishing.
If use BGA rework station or desoldering station.
1. BGA chip is difficult to be removed as soder ball melts but glue didn't.
2. uneven heat will damage the surrounding chip and PCB layers, heat especially will melt surrounded BGA chip’s solder point and cause short circuit.
If use IC grinding machine
1. we can engraving the whole chip and show the PCB pads.
2. PCB and chip may have tilt angle, it cause the engraving difficult to just cut a flat area, our smart IC remover has detector to check 4 corners of chip before engraving, we can then calculate the chip’s tilt angle.
3. Work without PC, just control the LCD touch screen we can easy to remove BGA chip.
4. No need to do glue removing.
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