VO Soft Thermal Pad Materials TP200

Features and Benefits

• Thermal conductivity: 2.0 W/m-K

• Conformable, low hardness

• Enhanced puncture, shear and tear resistance

• Electrically isolating

VO Soft Thermal Pad Materials is recommended for applications that require a minimum amount of pressure on components. Thermal Pad VO Soft is a highly conformable, low modulus, filled-silicone polymer on a rubber-coated fiberglass carrier. The material can be used as an interface where one side is in contact with a leaded device.

Typical Applications Include

• Telecommunications

• Computer and peripherals

• Power conversion

• Between heat-generating semiconductors or magnetic components and a heat sink

• Area where heat needs to be transferred to a frame, chassis, or other type of heat spreader