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Automotive Battery Charger Circuit Board Assembly With Copper Clad

Negotiable MOQ: 1 Set (Price negotiable depending on order volume and customization)

Key Specifications

Brand Name:

SYF

Place of Origin:

China

Model Number:

SYF-001

Shenzhen SYF Precision Electronics Limited.

Payment & Shipping

Payment Methods:

Port of Shipment:

China

Delivery Detail:

7 days

Brand Name SYF

Place of Origin China

Model Number SYF-001

Delivery Time:3-6 WEEKS
Certification:UL,ISO9001:2008,ROHS,REACH,HALOGEN FREE,SGS

Automotive Battery Charger Circuit Board Assembly with Copper Clad

Key Specifications/Special Features
1	We SYF have 6 PCB production lines and 4 advanced SMT lines with high speed.
2	All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP, QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach chip +0.1mm on integrated circuit parts.
3	We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging.
4	SMT/SMD assembly and through-hole components insertion
5	IC preprogramming
6	Function verification and burn in testing
7	Complete unit assembly (which including plastics, metal box, coil, cable inside and more)
8	Environmental coating
9	Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure
10	Packaging design and production of customized PCBA
11	100% quality assurance
12	High mixed, low volume order is also welcomed.
13	Full component procurement or the substitute components sourcing
14	UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant

3.PCB Assembly process capability

PRODUCTION CAPABILITY OF PCB ASSEMBLY
Stencil Size Range	756 mm x 756 mm
Min. IC Pitch	0.30 mm
Max. PCB Size	560 mm x 650 mm
Min. PCB Thickness	0.30 mm
Min. Chip Size	0201 (0.6 mm X 0.3 mm)
Max. BGA Size	74 mm X 74 mm
BGA Ball Pitch	1.00 mm (Min) / F3.00 mm (Max)
BGA Ball Diameter	0.40 mm (Min) /F1.00 mm (Max)
QFP Lead Pitch	0.38 mm (Min) /F2.54 mm (Max)
Frequency of Stencil Cleaning	1 time / 5 ~ 10 Pieces
Type of Assembly	SMT and Thru-hole
Solder Type	Water Soluble Solder Paste,Leaded and Lead-free
Type of Service	Turn-key,Partial Turn-key or consignment
File Formats	Bill of Materials(BOM)
Gerber Files
Pick-N-Places(XYRS)
Components	Passive Down to 0201 Size
BGA and VF BGA
Leadless Chip Carries/CSP
Double Sided SMT Assembly
BGA Repair and Reball
Part Removal and Replacement
Component Packaging	Cut Tape,Tube,Reels,Loose Parts
Testing Method	X-RAY Inspection and AOI Test
Ord