Pitch 2.50mm Wire to board PA66 Wafer connector housing / terminal

Delivery Time:5-8 working day
Certification:ISO9001/14001, ROHS , Reach, UL

Pitch 2.50mm Wire to board PA66 Wafer connector2.0mm housing / terminal

Description:

1,A2506series Housing have A2506H-NP .Wafer: A2506WV/WR-NP,DIP type,circlnal PIN,Tin-Plated.

2, Housing used materials: PA66, Halogen Free , Fire-protection rating is UL 94-V0. Minimum packing quantity is 1000pcs/bag.

4.Terminals are stamped by  Phosphor Bronze, E-Stamping before Tin-plated ,Tin-plated we calling A2506-TPe, Minimum packing quantity is 20,000pcs/Reel. The daily production capacity is 300 to 400 KPCS.

5.Terminals' wire range :AWG #22--#28,insulation OD is1.90mm(Max).

Specifications:

Test Description	Procedure	Requirement
Contact Resistance	Mate connectors, measure by dry circuit, 20mV max., 10mA.(Based upon JIS C5402 5.4)	10mΩ (Max.)
Insulation Resistance	Mate connectors, apply 500V DC between adjacent terminal or ground. (Based upon JIS C5402 5.2/MIL-STD-202 Method 302 Cond. B)	1000MΩ (Min.)
Dielectric Withstanding Voltage	Mate connectors, apply 1000V AC (rms) for 1 minute between adjacent terminal or ground. (Based upon JIS C5402 5.1/MIL-STD-202 Method 301)	No Breakdown.
Contact Resistance on Crimped Portion	Crimp the applicable wire on to the terminal, measure by dry circuit, 20mV (Max.)., 10mA..	5mΩ (Max.)

Voltage rated	250V AC ,DC
Current rated	3A  AC,DC
Withstand voltage	1000VAC/minute
Insulation resistance	1000MΩ Min
Contact resistance	20mΩ Max
Operating temperature	-25°C~85°C