Contact Platform Support
Help CenterThomas Sensors Encapsulating Adhesive
Related Products
-
Ceramics High Temperature Resistant AdhesiveNegotiableMOQ: 10 Kilograms -
Temperature Resistant Metal AdhesiveNegotiableMOQ: 10 Kilograms
-
High Strength Structural Magnet AdhesiveNegotiableMOQ: 1 Kilogram
-
PCB Boards Transplanting AdhesiveNegotiableMOQ: 10 Kilograms
-
Transformer Potting AdhesiveNegotiableMOQ: 100 Kilograms
Name |
High temperature resistant electronic components encapsulating adhesive（THO4054） |
Outline |
This double-component product is epoxy adhesive. It is easy and convenient to use for it solidifies fast at normal temperature and bonds well. No bubbles appear after curing thus making the surface smooth and bright. The series has two categories, room temperature curing and heat curing. Its viscosity, color and heat-resistance quality are adjustable. |
Applications |
It applies to the encapsulating electronic components and chips in transformers, rectifiers, AC capacitor, ignition coils, electronic modules, negative ion generator, atomizer, and other products to protect them against moisture, chemicals, excessive heat, vibration, mechanical impact and thermal shocks. |
Features |
Component A is pasty, non-solid particle. component B is in tinted paste shape. Fast curing velocity. At 25°C, within 1-3 hours, it is at the early stage of curing, 12 hours later, it reaches its maximum bonding strength. Being durable and resistant to ultraviolet light once the bond has formed. Being heat-resistant, it adapts to a wide range of temperature and bonds well under high temperature. Mix the two components in a certain proportion, apply it to the surface of the substrates directly, which makes it so convenient to use. You.ll get long term durability and resistance to moisture, chemicals, oils, and temperature extremes. Non-toxic after solidification, though it is a little smelly. Being stable, its storage time is one and a half year. The main technical parameters are as follows: Heat resistance scope：-40°C—+ 380°C volume resistance: 1×10×15Ω.cm sheet resistance 2.5×1015Ω voltage withstand 20-24kV/mm hardness shore D 90 Water absorbing capacity 24h＜0.1% Tg:300-400℃ Cementation intensity: Tensile strength≥25MPa; Shearing strength≥20 MPa |
Instruction |
1. To get the best results, the two surfaces being bonded should be free of oils, dirt, moisture and other contaminants and should be slightly roughed or sanded to remove gloss. 2. Mix A and B in a proportion of 10:1.2--1.5 to get perfect bonding result at fastest speed at 25 °C. 3. Spread the mixture on the substrates, put them together and apply some strength on them, finally, let them dry for 2-4 hours. |
Notes |
1.The tools used to get adhesives should have exclusive usage. 2. It is necessary to keep it well ventilated and away from fire . 3.If it has contact with skin, you should wash thoroughly with soap and water. 4. It can be stored at well-ventilated places with low temperature, and keep them away from fire. Cover the lip after using it. |
Copyright © 2005-2019 Thomas Technology, Inc. All Rights Reserved.
Send Inquiry to This Supplier
You May Also Like
-
Moisture and Temperature Resistant AdhesiveNegotiableMOQ: 10 Kilograms
-
Thermally Conductive AdhesiveNegotiableMOQ: 10 Kilograms
-
Thomas Silicon Steel Sheets AdhesiveNegotiableMOQ: 10 Kilograms
-
Thomas High Strength Structural Adhesive Bonding Carbide Cutting ToolsNegotiableMOQ: 10 Kilograms
-
Thomas High Temperature Resistant Adhesive Used in HEPANegotiableMOQ: 10 Kilograms
-
Thomas High Strength Structural AdhesiveNegotiableMOQ: 10 Kilograms
-
Thomas Temperature Shocks Resistant AdhesiveNegotiableMOQ: 10 Kilograms
-
Thomas High Temperature Resistant Silicon Steel Sheets AdhesiveNegotiableMOQ: 10 Kilograms
-
Thomas High Temperature Resistant Magnetic Motor AdhesiveNegotiableMOQ: 10 Pieces
-
Thomas High Temperature Resistant Electronic Components Encapsulating AdhesiveNegotiableMOQ: 1 Piece
