Thermal conductive silicone cloth

thermal conductive material Main features: thermal conductivity, insulation,sel-adhesive, shock, fill.
thermal conductive material Uses: used in electrical and electronic products, control board, TFT-LCD, notebook computers, power supply,High efficiency led lamp and other products, from thermal conductivity, filling, damping effect; can be added one-sided silicone cloth to enhance its mechanical properties, can be directly glued to the surface of the body parts without the need for reinforcement with the bolt and so on. (According to the different needs of customers into any shape of die-cut sheets can also be affixed adhesive or gluing).

Typical applications: Customers can heat body and heat sink the size of the gap between the selection of a suitable thickness of the thermal silica films, used in electronic products, electronic equipment, heating power devices (integrated circuits, power management, SCR, transformers, etc.) and the cooling facilities (heat sink, aluminum, etc.) in close contact, to achieve better thermal conductivity results.

 

thermal conductive material -thermal sheet

 

    

Test Project	test results flat thermal silica films		Units	testing standards
	TPB	TPW
color	All	All	---	Visual
thickness	0.5-12	0.5-12	mm	ASTM D374
The proportion	1.8±0.3	2.0±0.3	---	ASTM D792
Hardness	12-45	12-45	Shore C	ASTM D2240
Temperature range	-40~+220	-40~+220		EN 344
Breakdown voltage	>6	>6	Kv/mm	ASTM D149
Volume Impedance	>1.2×1011	1.0×1011	Ω.cm	ASTM D257
Blocking probability	V-0	V-0	--	UL-94
Thermal Conductivity	3.0	1.0	W/mk	ASTM D5470

 

 

 

 

 

 

 

 

 

 

 

 

Notes: 1, commonly used colors: reyish whitegrey black

          2, common thickness :0.5-12mm
          3, the basic specifications: T (0.5 ~ 12mm), W (200mm&300mm), L (400mm&300mm)
          4, color and specifications can be produced according to the requirements of the guests.
Features: thermal conductivity, insulation, self-adhesive, shock, filling, electrical and electronic products for the control of motherboards, notebook computers, power supply, LED lighting and other products, from thermal conductivity, filling, cushioning effect; used in electronic products, heat between power devices and cooling facilities in close contact, to achieve better thermal conductivity results