BGA X Ray PCB Assembly Board Printed Circuit Board Fabrication

BGA X Ray PCB Assembly Board Printed Circuit Board Fabrication

Huaswin specialized in PCB manufacturing and and PCB Assembly

PCBA capabilities: 

Fast prototyping
High mix, low and medium volume build
SMT MinChip:0201
BGA: 1.0 to 3.0 mm pitch
Through-hole assembly
Special processes (such as conformal coating and potting)
ROHS capability
IPC-A-610E and IPC/EIA-STD workmanship operation


Quality Assurance:
 
ISO9001 and ISO/TS16949 management systems
Lean production system
ERP and PTS system support for management
 

Quality Processes: 

1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection (FAI) for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008, ISO/TS16949

Testing:  

AOI (Automatic optical inspection)
ICT(In-circuit test)
Reliability test
X-Ray Test
Analogue and digital function test
Firmware programming


Rich experience for SUPPLY CHAIN MANAGEMENT for components, moldings, stamping, plastic injection parts etc.
 
Contat us for your RFQ!

Factory view: