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Home > Electrical & Electronics > Passive Components > Resistor & Potentiometer > ISO9001 Turnkey PCB Assembly Prototype Circuit Boards , LCD PCB Board Assembly

ISO9001 Turnkey PCB Assembly Prototype Circuit Boards , LCD PCB Board Assembly

Name: ISO9001 Turnkey PCB Assembly Prototype Circuit Boards , LCD PCB Board Assembly
Brand: HUASWIN
SKU: 149710254
Availability: InStock

Huaswin Electronics Company

ISO9001 Turnkey PCB Assembly Prototype Circuit Boards , LCD PCB Board Assembly thumbnail-1

ISO9001 Turnkey PCB Assembly Prototype Circuit Boards , LCD PCB Board Assembly photo-1

Negotiable MOQ: 1 Piece (Price negotiable depending on order volume and customization)

Key Specifications

Get Latest Price

Brand Name:

HUASWIN

Place of Origin:

China

Model Number:

HSPCBA1004

Contact Supplier Request Quote Chat Now

Payment & Shipping

Payment Methods:

Port of Shipment:

China

Delivery Detail:

7 days

Product Details
Company Profile
Contact Us

Brand Name HUASWIN

Place of Origin China

Model Number HSPCBA1004

Delivery Time:15-20 working days
Certification:ISO/UL/RoHS

ISO9001 Turnkey PCB Assembly Prototype Circuit Boards , LCD PCB Board Assembly

Detailed Specification of PCB Manufacturing

1	layer	1-30 layer
2	Material	CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
3	Board thickness	0.2mm-6mm
4	Max.finished board size	800*508mm
5	Min.drilled hole size	0.25mm
6	min.line width	0.075mm(3mil)
7	min.line spacing	0.075mm(3mil)
8	Surface finish	HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP
9	Copper thickness	0.5-4.0oz
10	Solder mask color	green/black/white/red/blue/yellow
11	Inner packing	Vacuum packing,Plastic bag
12	Outer packing	standard carton packing
13	Hole tolerance	PTH:±0.076,NTPH:±0.05
14	Certificate	UL,ISO9001,ISO14001,ROHS,TS16949
15	Profiling punching	Routing,V-CUT,Beveling

PCB Assembly services:

SMT Assembly
Automatic Pick & Place
Component Placement as Small as 0201
Fine Pitch QEP - BGA
Automatic Optical Inspection

Through-hole Assembly
Wave Soldering
Hand Assembly and Soldering

Material Sourcing
IC pre-programming / Burning on-line

Function testing as requested

Aging test for LED and Power boards

Complete unit assembly (which including plastics, metal box, Coil, cable assembly etc)
Packing design

Testing Methods

AOI Testing
Checks for solder paste
Checks for components down to 0201\"
Checks for missing components, offset, incorrect parts, polarity

X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Bare boards

In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional defects caused by

component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing

Factory view: