Home > Products > Circuit Board Assembly > Touch Screen Circuit Board Assembly Lead Free PCB with HAL Surface
Touch Screen Circuit Board Assembly Lead Free PCB with HAL Surface
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Product Details
Brand Name | HUASWIN | Place of Origin | China | |
Model Number | HSPCBA1070 |
Product Description
Certification:ISO/UL/RoHS
Touch Screen Circuit Board Assembly Lead Free PCB with HAL Surface
Specifications
- Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds
PCB capability and services:
1. Single-sided, double-sided & multi-layer PCB (up to 30 layers)
2. Flexible PCB (up to 10 layers)
3. Rigid-flex PCB (up to 8 layers)
4. CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material.
5. HAL, HAL lead free, Immersion Gold/ Silver/Tin, Hard Gold, OSP surface treatment.
6. Printed Circuit Boards are 94V0 compliant, and adhere to IPC610 Class 2 international PCB standard.
7. Quantities range from prototype to volume production.
8. 100% E-Test
Detailed Specification of PCB Manufacturing
1 |
layer |
1-30 layer |
2 |
Material |
CEM-1, CEM-3 FR-4, FR-4 High TG, Polyimide, Aluminum-based material. |
3 |
Board thickness |
0.2mm-6mm |
4 |
Max.finished board size |
800*508mm |
5 |
Min.drilled hole size |
0.25mm |
6 |
min.line width |
0.075mm(3mil) |
7 |
min.line spacing |
0.075mm(3mil) |
8 |
Surface finish |
HAL, HAL Lead free,Immersion Gold/ Silver/Tin, Hard Gold, OSP |
9 |
Copper thickness |
0.5-4.0oz |
10 |
Solder mask color |
green/black/white/red/blue/yellow |
11 |
Inner packing |
Vacuum packing,Plastic bag |
12 |
Outer packing |
standard carton packing |
13 |
Hole tolerance |
PTH:±0.076,NTPH:±0.05 |
14 |
Certificate |
UL,ISO9001,ISO14001,ROHS,TS16949 |
15 |
Profiling punching |
Routing,V-CUT,Beveling |
Detailed Specification of Pcb Assembly
1 |
Type of Assembly |
SMT and Thru-hole |
2 |
Solder Type |
Water Soluble Solder Paste,Leaded and Lead-Free |
3 |
Components |
Passives Down to 0201 Size |
BGA and VFBGA |
||
Leadless Chip Carries/CSP |
||
Double-Sided SMT Assembly |
||
Fine Pitch to 08 Mils |
||
BGA Repair and Reball |
||
Part Removal and Replacement-Same Day Service |
||
3 |
Bare Board Size |
Smallest:0.25x0.25 Inches |
Largest:20x20 Inches |
||
4 |
File Formats |
Bill of Materials |
Gerber Files |
||
Pick-N-Place File(XYRS) |
||
5 |
Type of Service |
Turn-Key,Partial Turn-Key or Consignment |
6 |
Component Packaging |
Cut Tape |
Tube |
||
Reels |
||
Loose Parts |
||
7 |
Turn Time |
15 to 20 days |
8 |
Testing |
Contact Us
- Huaswin Electronics Co.,Limited
- Contact nameMs. Vicky Lee Chat Now
- Phone86-755-29077956
- Address28D, Block D, Jin Gang Hua Ting, Xi Xiang, Bao An, Shen Zhen, Rizhao, Shandong
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