12 Layer PCB Printed Circuit Board Hard Gold Plating PCB Assembly

12 Layer PCB Printed Circuit Board Hard Gold Plating PCB Assembly

Specifications: 

Production processes:

Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping 

Requested information for PCB assembly: 

1. Components list 
(a) Specification, brand, footprint 
(b)To short the lead time, please kindly advise us if there is any acceptable components substitution. 
(c) Schematic if necessary 

2. PCB board information 
(a) Gerber files 
(b) PCB board processing technical data

3. Testing Guide & Test Fixtures if necessary 

4. Programming files & Programming tool if necessary 

5. Package requirement 

Quality Assurance: 
 
Our Quality processes include: 
1. IQC: Incoming Quality Control (Incoming Materials Inspection)
2. First Article Inspection for every process 
3. IPQC: In Process Quality Control
4. QC: 100% Test & Inspection
5. QA: Quality Assurance based on QC inspection again
6. Workmanship: IPC-A-610, ESD
7. Quality Management based on CQC, ISO9001:2008