Home > Products > PCB Fabrication and Assembly > Teflon / Polyimide PI Base PCB Printed Circuit Board for Tablet PC
Teflon / Polyimide PI Base PCB Printed Circuit Board for Tablet PC
- 0 Piece / Pieces per Month
- T/T L/C D/P D/A
- 7 days
Product Details
Brand Name: | agilecircuit | Place of Origin: | China | Model Number: | PCBPCBARO4350 |
Product Description
Certification:ISO9001,UL, RoHs, TS16949
Teflon / Polyimide PI Base PCB Printed Circuit Board for Tablet PC
1. Printed Circuit Board PCB Fabrication and Assembly from China
2. PCB Fabrication and Assembly in One Stop Solution
3. FR4, Aluminium and PI Base Material Support
4. Circuit Boards Manufacturing with Good Quality and Low Cost
6. Integrate PCB Contract Manufacturing service
Description
Agile Circuit provides printed circuit board PCB Fabrication and assembly full turn-key PCB contract manufacturing and also partial bare circuit boards fabrication or PCB assembly services. Based in Shenzhen, Guangdong, we have been engaged in PCB fabrication and PCB assembly, serving many OEM & ODM electronics manufacturer, research & development engineering company from all over the world more than 6 years.
PCB fabrication Spec:
Layers |
Mass production: 1~26 layers |
Max. Thickness |
Mass production: 4.0mm |
Material |
FR-4 (Standard FR4, Medium Tg FR4,High Tg FR4, Lead free assembly material) , Halogen-Free, Ceramic filled , Teflon, Polyimide, BT, Hybrid, Rogers etc. |
Min. Width/Spacing |
Inner layer: 3mil/3mil (0.5oz), Outer layer: 4mil/4mil(1oz) |
Max. Copper Thickness |
6.0 oz |
Min. Hole Size |
Mechanical drill: 8mil Laser drill: 3mil |
Max. Panel Size |
600mm × 700mm |
Aspect Ratio |
12:1 |
Surface Finish |
HASL, Immersion Gold, Immersion Tin, OSP, ENIG + OSP, Immersion Silver, ENEPIG, Gold Finger |
Special Process |
Buried Hole, Blind Hole, Embedded Resistance, Embedded Capacity, Hybrid, Partial hybrid, Partial high density, Back drilling, and Resistance control. |
PCB Assembly Spec.:
SMT |
Position accuracy: 20 um |
Components size: 0804,0603,0402,Flip-CHIP,QFP,BGA,POP |
|
Max. component height:25mm |
|
Max. PCB size:580×600mm |
|
Min. PCB size: no limited |
|
PCB thickness:0.3 to 6mm |
|
Wave-Solder |
Max. PCB width:450mm |
Min. PCB width: no limited |
|
Component height: Top 120mm/ Bot 15mm |
|
Sweat-Solder |
Metal type :part, whole, inlay, sidestep |
Metal material: Copper , Aluminum |
|
Surface Finish: plating Au, plating sliver , plating Sn |
|
Air bladder rate: less than20% |
|
Press-fit |
Press range:0-50KN |
Max. PCB size:800X600mm |
|
Testing |
ICT, Probe flying, burn-in, function test, temperature cycling |
Advantage:
1. Affordable Cost, Stable Quality
Years of manufacturing experience of our factory, standard PCB fabricating process, state-of-the-art PCB produce technology, supreme supply chain management, strict trained staff enable our circuit boards are at affordable in good quality.
2. Flexibility, Quick response
We are flexible with delivery schedules and able to provide relatively fast turnaround on both sample and mass PCB production quantities. Quick turn PCB prototyping service with delivery is available for 24 hours.
3. On-time delivery, High customer satisfactory
Our delivery reliability rate is above 95%.Our PCB factory pioneer the end-to-end WIP online software
Contact Us
- Agile Circuit Co., Ltd.
- Contact nameMs. Cathy Quan
- Phone86-755-86050627
- Address5F A building, Shenhui Square, Xixiang Road Weifang,Shandong
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